SLLSFC5C November   2021  – January 2023 ISOUSB211

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Switching Characteristics
    11. 6.11 Insulation Characteristics Curves
    12. 6.12 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Test Circuits
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Power Supply Options
      2. 8.3.2  Power Up
      3. 8.3.3  Symmetric Operation, Dual-Role Port and Role-Reversal
      4. 8.3.4  Connect and Speed Detection
      5. 8.3.5  Disconnect Detection
      6. 8.3.6  Reset
      7. 8.3.7  LS/FS Message Traffic
      8. 8.3.8  HS Message Traffic
      9. 8.3.9  Equalization and Pre-emphasis
      10. 8.3.10 L2 Power Management State (Suspend) and Resume
      11. 8.3.11 L1 Power Management State (Sleep) and Resume
      12. 8.3.12 HS Test Mode Support
      13. 8.3.13 CDP Advertising
    4. 8.4 Device Functional Modes
  10. 9 Power Supply Recommendations
  11. 10Application and Implementation
    1. 10.1 Typical Application
      1. 10.1.1 Isolated Host or Hub
      2. 10.1.2 Isolated Peripheral - Self-Powered
      3. 10.1.3 Isolated Peripheral - Bus-Powered
      4. 10.1.4 Application Curve
        1. 10.1.4.1 Insulation Lifetime
    2. 10.2 Meeting USB2.0 HS Eye-Diagram Specifications
    3. 10.3 Thermal Considerations
      1. 10.3.1 VBUS / V3P3V Power
      2. 10.3.2 VCCx / V1P8Vx Power
      3. 10.3.3 Example Configuration 1
      4. 10.3.4 Example Configuration 2
      5. 10.3.5 Example Configuration 3
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Layout Example
      2. 11.1.2 PCB Material
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
  • DP|28
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Power Supply Recommendations

0.1 µF capacitors are recommended to be placed very close to V3P3Vx pins to GNDx. 1-µF capacitors are recommended to be placed placed very close to VBUSx pins to GNDx. 2-µF, 0.1-µF, and 10-nF capacitors are recommended to be placed between V1P8Vx and GNDx, between pins 4 and 3, between pins 25 and 26, between pins 11 and 12, and between pins 25 and 26 respectively, as close to the device as possible. Place the lower value capacitors closer to the IC. If VCCx pins are connected through resistors as shown in Example Configuration 3 1-µF capacitors are recommended to be placed between VCCx (pins 5, 24) and GNDx (pins 3, 26), as close to the device as possible, with higher priority being accorded to the capacitors on V1P8Vx pins.

These decoupling capacitor recommendations are irrespective of whether the 3.3 V and 1.8 V supplies are provided externally or generated using internal LDOs.

Refer to the Section 11.1.1 section for recommended placement of the decoupling capacitors. Small footprint capacitors (0402/0201) are recommended so that these may be placed very close to the supply pins and corresponding ground pins on the top layer without the use of vias. The capacitors on V1P8Vx supplies are higher in priority when considering placement close to the IC.

While isolating a host/hub or bus-powered peripherals, isolated power is needed and can be generated with the help of a transformer driver such as TI's SN6505B. For such applications, detailed power supply design, and transformer selection recommendations are available in the SN6505 Low-Noise 1-A Transformer Drivers for Isolated Power Supplies data sheet. If CDP functionality is enabled while isolation host/hub, the isolated power supply must be capable of delivering 1.5 A on VBUS.