SLLSFC5D November   2021  – April 2025 ISOUSB211

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Insulation Characteristics Curves
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Test Circuits
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power Supply Options
      2. 7.3.2  Power Up
      3. 7.3.3  Symmetric Operation, Dual-Role Port, and Role-Reversal
      4. 7.3.4  Connect and Speed Detection
      5. 7.3.5  Disconnect Detection
      6. 7.3.6  Reset
      7. 7.3.7  LS/FS Message Traffic
      8. 7.3.8  HS Message Traffic
      9. 7.3.9  Equalization and Pre-emphasis
      10. 7.3.10 L2 Power Management State (Suspend) and Resume
      11. 7.3.11 L1 Power Management State (Sleep) and Resume
      12. 7.3.12 HS Test Mode Support
      13. 7.3.13 CDP Advertising
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Isolated Host or Hub
      2. 8.1.2 Isolated Peripheral - Self-Powered
      3. 8.1.3 Isolated Peripheral - Bus-Powered
      4. 8.1.4 Application Curve
        1. 8.1.4.1 Insulation Lifetime
      5. 8.1.5 Meeting USB 2.0 HS Eye-Diagram Specifications
    2. 8.2 Thermal Considerations
      1. 8.2.1 VBUS / V3P3V Power
      2. 8.2.2 VCCx / V1P8Vx Power
      3. 8.2.3 Example Configuration 1
      4. 8.2.4 Example Configuration 2
      5. 8.2.5 Example Configuration 3
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Layout Example
        2. 8.4.1.2 PCB Material
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
  • DP|28
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision C (January 2023) to Revision D (April 2025)

  • Updated the number format for tables, figures, and cross-references throughout the documentGo
  • Updated throughout the document to correct typosGo
  • Changed Clearance and Creepage From: 8 mm To: 8.15 mmGo
  • Removed certification ratings row as this information is available in the certificates.Go
  • Updated Insulation Lifetime Projection Data image.Go
  • Changed the DP0028A-C01 package outline with DP0028A-C02Go

Changes from Revision B (September 2022) to Revision C (January 2023)

  • Removed "Basic" option from data sheet.Go

Changes from Revision A (March 2022) to Revision B (September 2022)

  • Updated device status to Production Data.Go

Changes from Revision * (November 2021) to Revision A (March 2022)

  • TA Max value updated to 125°CGo
  • Updated Thermal Considerations section.Go