SNVS859C July   2012  – September 2016 LM25101

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Start-Up and UVLO
      2. 8.3.2 Level Shift
      3. 8.3.3 Output Stages
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selecting External Gate Driver Resistor
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

DGN and DDA Packages
8-Pin MSOP and SO PowerPAD
Top View
NGT Package
8-Pin WSON
Top View
D Package
8-Pin SOIC
Top View
DPR Package
10-Pin WSON
Top View

Pin Functions

PIN TYPE DESCRIPTION
NAME MSOP PowerPAD WSON (8) WSON (10) SO PowerPAD SOIC
HB 2 2 2 2 2 PWR High-side gate driver bootstrap rail. Connect the positive terminal of the bootstrap capacitor to HB and the negative terminal to HS. The bootstrap capacitor should be placed as close to the IC as possible.
HI 5 5 7 5 5 I High-side driver control input. The LM25101 inputs have TTL type thresholds. Unused inputs should be tied to ground and not left open.
HO 3 3 3 3 3 O High-side gate driver output. Connect to the gate of high-side MOSFET with a short, low inductance path.
HS 4 4 4 4 4 GND High-side MOSFET source connection. Connect to the bootstrap capacitor negative terminal and the source of the high-side MOSFET.
LI 6 6 8 6 6 I Low-side driver control input. The LM25101 inputs have TTL type thresholds. Unused inputs should be tied to ground and not left open.
LO 8 8 10 8 8 O Low-side gate driver output. Connect to the gate of the low-side MOSFET with a short, low inductance path.
NC — — 5, 6 — — — No connection
VDD 1 1 1 1 1 PWR Positive gate drive supply. Locally decouple to VSS using a low ESR and ESL capacitor located as close to the IC as possible.
VSS 7 7 9 7 7 GND Ground return. All signals are referenced to this ground.
Thermal Pad PowerPAD Thermal Pad Thermal Pad PowerPAD — — Solder to the ground plane under the IC to aid in heat dissipation.(1)
(1) TI recommends that the exposed thermal pad on the bottom of the applicable packages is soldered to ground plane of the PCB, and the ground plane should extend out from beneath the IC to help dissipate heat.