SNVS859C July   2012  – September 2016 LM25101

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Start-Up and UVLO
      2. 8.3.2 Level Shift
      3. 8.3.3 Output Stages
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selecting External Gate Driver Resistor
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VDD to VSS −0.3 18 V
HB to HS −0.3 18 V
LI or HI Input −0.3 VDD + 0.3 V
LO Output −0.3 VDD + 0.3 V
HO Output VHS - 0.3 VHB + 0.3 V
HS to VSS(2) –5 100 V
HB to VSS 100 V
Junction temperature, TJ 150 °C
Storage temperature, Tstg –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. For performance limits and associated test conditions, see the Electrical Characteristics tables.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) All pins except 2, 3, and 4 ±2000 V
Pins 2, 3, and 4 ±1000
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±250
Machine model (MM) ±100
(1) The Human Body Model (HBM) is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VDD Supply voltage VDD 9 14 V
VHS Voltage HS –1 100 – VDD V
VHB Voltage HB VHS + 8 VHS + 14 V
HS slew rate 50 V/ns
TJ Junction temperature –40 125 °C

7.4 Thermal Information

THERMAL METRIC(1) LM25101A, LM25101B LM25101C UNIT
D (SOIC) DDA (SO PowerPAD) NGT (WSON) DPR (WSON) D (SOIC) DPR (WSON) DGN (MSOP PowerPAD)
8 PINS 8 PINS 8 PINS 10 PINS 8 PINS 10 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 108.2 46.1 38.2 37.8 111.5 39.8 54.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.6 53.5 36.3 35.8 54.2 39.1 55.9 °C/W
RθJB Junction-to-board thermal resistance 49.1 13.8 15.2 15.0 52.3 17.1 15.1 °C/W
ψJT Junction-to-top characterization parameter 7.6 4.2 0.3 0.3 9.0 0.4 2.4 °C/W
ψJB Junction-to-board characterization parameter 48.5 13.9 15.4 15.3 51.7 17.3 15.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — 3.9 4.5 4.4 — 6.1 4.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

7.5 Electrical Characteristics

Typical values apply for TJ = 25°C only. Minimum and maximum limits apply for TJ= –40°C to 125°C.(1) Unless otherwise specified, VDD = VHB = 12 V, VSS = VHS = 0 V, No Load on LO or HO.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENTS
IDD VDD quiescent current VLI = VHI = 0 V 0.25 0.4 mA
IDDO VDD operating current f = 500 kHz 2.0 3 mA
IHB Total HB quiescent current VLI = VHI = 0 V 0.06 0.2 mA
IHBO Total HB operating current f = 500 kHz 1.6 3 mA
IHBS HB to VSS current (quiescent) VHS = VHB = 100 V 0.1 10 µA
IHBSO HB to VSS current (operating) f = 500 kHz 0.4 mA
INPUT PINS
VIL Input voltage threshold Rising Edge 1.3 1.8 2.3 V
VIHYS Input voltage hysteresis 50 mV
RI Input pulldown resistance 100 200 400 kΩ
UNDER VOLTAGE PROTECTION
VDDR VDD rising threshold 6.0 6.9 7.4 V
VDDH VDD threshold hysteresis 0.5 V
VHBR HB rising threshold 5.7 6.6 7.1 V
VHBH HB threshold hysteresis 0.4 V
BOOT STRAP DIODE
VDL Low-current forward voltage IVDD-HB = 100 µA 0.52 0.85 V
VDH High-current forward voltage IVDD-HB = 100 mA 0.8 1 V
RD Dynamic resistance IVDD-HB = 100 mA 1.0 1.65 Ω
LO AND HO GATE DRIVER
VOL Low-level output voltage IHO = ILO = 100 mA A version 0.12 0.25 V
B version 0.16 0.4
C version 0.28 0.65
VOH High-level output voltage IHO = ILO = 100 mA
VOH = VDD – VLO or
VOH = VHB – VHO		 A version 0.24 0.45 V
B version 0.28 0.60
C version 0.60 1.10
IOHL Peak pullup current HO, VLO = 0 V A version 3 A
B version 2
C version 1
IOLL Peak pulldown current HO, VLO = 12 V A version 3 A
B version 2
C version 1

7.6 Switching Characteristics

Typical values apply for TJ = 25°C only. Minimum and maximum limits apply for TJ= –40°C to 125°C.(1) Unless otherwise specified, VDD = VHB = 12 V, VSS = VHS = 0 V, No Load on LO or HO.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tLPHL LO turnoff propagation delay LI falling to LO falling 22 56 ns
tLPLH LO turnon propagation delay LI rising to LO rising 26 56 ns
tHPHL HO turnoff propagation delay HI falling to HO falling 22 56 ns
tHPLH LO turnon propagation delay HI rising to HO rising 26 56 ns
tMON Delay matching LO ON and HO OFF 4 10 ns
tMOFF Delay matching LO OFF and HO ON 4 10 ns
tRC, tFC Either output rise and fall time CL = 1000 pF 8 ns
tR Output rise time (3 V to 9 V) CL = 0.1 µF A version 430 ns
B version 570
C version 990
tF Output fall time (3 V to 9 V) CL = 0.1 µF A version 260 ns
B version 430
C version 715
tPW Minimum input pulse duration that changes the output 50 ns
tBS Bootstrap diode reverse recovery time IF = 100 mA, IR = 100 mA 37 ns
(1) Minimum and maximum limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) In the application the HS node is clamped by the body diode of the external lower N-MOSFET, therefore the HS node will generally not exceed –1 V. However, in some applications, board resistance and inductance may result in the HS node exceeding this stated voltage transiently. If negative transients occur, the HS voltage must never be more negative than VDD – 15 V. For example, if VDD = 10 V, the negative transients at HS must not exceed –5 V.
LM25101 30192904.gif Figure 1. Timing Diagram

7.7 Typical Characteristics

LM25101 30192927.gif Figure 2. Peak Sourcing Current vs Supply Voltage
LM25101 30192929.gif Figure 4. Sink Current vs Output Voltage
LM25101 30192910.gif Figure 6. IDD vs Frequency
LM25101 30192914.gif Figure 8. IHB vs Frequency
LM25101 30192919.gif Figure 10. Quiescent Current vs Temperature
LM25101 30192917.gif Figure 12. Undervoltage Threshold Hysteresis
vs Temperature
LM25101 30192924.gif Figure 14. Input Threshold vs Temperature
LM25101 30192913.gif Figure 16. Propagation Delay vs Temperature
LM25101 30192921.gif Figure 18. LO and HO Gate Drive:
Low Level Output Voltage vs Temperature
LM25101 30192932.gif Figure 20. LO and HO Gate Drive:
Output Low Voltage vs Supply Voltage
LM25101 30192928.gif Figure 3. Peak Sinking Current vs Supply Voltage
LM25101 30192930.gif Figure 5. Source Current vs Output Voltage
LM25101 30192911.gif Figure 7. Operating Current vs Temperature
LM25101 30192918.gif Figure 9. Quiescent Current vs Supply Voltage
LM25101 30192922.gif Figure 11. Undervoltage Rising Thresholds
vs Temperature
LM25101 30192915.gif Figure 13. Bootstrap Diode Forward Voltage
LM25101 30192926.gif Figure 15. Input Threshold vs Supply Voltage
LM25101 30192920.gif Figure 17. LO and HO Gate Drive:
High Level Output Voltage vs Temperature
LM25101 30192931.gif Figure 19. LO and HO Gate Drive:
Output High Voltage vs Supply Voltage