SNVS129G May   2004  – June 2025 LM2675

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
      1. 5.4.1 Electrical Characteristics – 3.3 V
    5. 5.5  Electrical Characteristics – 5 V
    6. 5.6  Electrical Characteristics – 12 V
    7. 5.7  Electrical Characteristics – Adjustable
    8. 5.8  Electrical Characteristics – All Output Voltage Versions
    9. 5.9  Typical Characteristics
    10. 5.10 Typical Characteristics – Fixed Output Voltage Versions
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Adjustable Output Voltage
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 Active Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Fixed Output Voltage Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Custom Design with WEBENCH® Tools
          2. 7.2.1.2.2 Inductor Selection (L1)
          3. 7.2.1.2.3 Output Capacitor Selection (COUT)
          4. 7.2.1.2.4 Catch Diode Selection (D1)
          5. 7.2.1.2.5 Input Capacitor (CIN)
          6. 7.2.1.2.6 Boost Capacitor (CB)
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Adjustable Output Voltage Application
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Programming Output Voltage
          2. 7.2.2.2.2 Inductor Selection (L1)
          3. 7.2.2.2.3 Output Capacitor SeIection (COUT)
          4. 7.2.2.2.4 Catch Diode Selection (D1)
          5. 7.2.2.2.5 Input Capacitor (CIN)
          6. 7.2.2.2.6 Boost Capacitor (CB)
        3. 7.2.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 WSON Package Devices
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Custom Design with WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)(2)LM2675UNIT
SOIC (D)PDIP (P)NHN (WSON)
8 PINS8 PINS16 PINS
RθJAJunction-to-ambient thermal resistance(3)10595—°C/W
RθJC(top)Junction-to-case (top) thermal resistance———°C/W
RθJBJunction-to-board thermal resistance———°C/W
ψJTJunction-to-top characterization parameter———°C/W
ψJBJunction-to-board characterization parameter———°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance———°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) Thermal resistances were simulated on 4-layer JEDEC board.
(3) Junction-to-ambient thermal resistance with approximately 1 square inch of printed-circuit board copper surrounding the leads. Additional copper area lowers thermal resistance further. See Section 7.1 in the application note accompanying this data sheet. The value RθJA for the WSON (NHN) package is specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to AN-1187 Leadless Leadframe Package (LLP) application note.