SNVS129G May   2004  – June 2025 LM2675

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
      1. 5.4.1 Electrical Characteristics – 3.3 V
    5. 5.5  Electrical Characteristics – 5 V
    6. 5.6  Electrical Characteristics – 12 V
    7. 5.7  Electrical Characteristics – Adjustable
    8. 5.8  Electrical Characteristics – All Output Voltage Versions
    9. 5.9  Typical Characteristics
    10. 5.10 Typical Characteristics – Fixed Output Voltage Versions
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Adjustable Output Voltage
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 Active Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Fixed Output Voltage Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Custom Design with WEBENCH® Tools
          2. 7.2.1.2.2 Inductor Selection (L1)
          3. 7.2.1.2.3 Output Capacitor Selection (COUT)
          4. 7.2.1.2.4 Catch Diode Selection (D1)
          5. 7.2.1.2.5 Input Capacitor (CIN)
          6. 7.2.1.2.6 Boost Capacitor (CB)
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Adjustable Output Voltage Application
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Programming Output Voltage
          2. 7.2.2.2.2 Inductor Selection (L1)
          3. 7.2.2.2.3 Output Capacitor SeIection (COUT)
          4. 7.2.2.2.4 Catch Diode Selection (D1)
          5. 7.2.2.2.5 Input Capacitor (CIN)
          6. 7.2.2.2.6 Boost Capacitor (CB)
        3. 7.2.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 WSON Package Devices
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Custom Design with WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision F (June 2016) to Revision G (June 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the document Go
  • Added WEBENCH information Go
  • Added DAP connection informationGo
  • Added information relating to WEBENCHGo
  • Added information relating to WEBENCHGo
  • Added information relating to WEBENCHGo

Changes from Revision E (June 2005) to Revision F (June 2016)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Deleted all instances of the computer design software LM267X Made Simple (version 6.0)Go