SLVS297Q April   2000  – July 2025 LM317M , LM317MQ

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics (Both Legacy and New Chip)
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Current Limit
      2. 6.3.2 Dropout Voltage (VDO)
      3. 6.3.3 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
  8. 7 Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1  Input and Output Capacitor Requirements (Legacy Chip)
        2. 7.2.2.2  Input and Output Capacitor Requirements (New Chip)
        3. 7.2.2.3  Feedback Resistors
        4. 7.2.2.4  Adjustment Pin Capacitor
        5. 7.2.2.5  Protection Diodes
        6. 7.2.2.6  Overload Recovery
        7. 7.2.2.7  Estimating Junction Temperature
        8. 7.2.2.8  Polarity Reversal Protection
        9. 7.2.2.9  Reverse Current
        10. 7.2.2.10 Power Dissipation (PD)
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Evaluation Module
      2. 8.1.2 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.2.3 Application Curves

LM317M LM317MQ Line Transient Response vs Time (Legacy Chip)
 
 
Figure 7-3 Line Transient Response vs Time (Legacy Chip)
LM317M LM317MQ Load Transient Response vs Time (Legacy Chip)
 
 
Figure 7-5 Load Transient Response vs Time (Legacy Chip)
LM317M LM317MQ Load Transient Response vs Time (New Chip)
 VIN = 15V, VOUT = 1.25V, IL = 10mA to 500mA, CADJ = 10µF, COUT = 1µF
Figure 7-7 Load Transient Response vs Time (New Chip)
LM317M LM317MQ Line Transient Response vs Time (New Chip)
 VIN = 14.5V to 15.5V, VOUT = 1.25V, IL = 50mA, CADJ = 0µF, COUT = 0µF
Figure 7-4 Line Transient Response vs Time (New Chip)
LM317M LM317MQ Load Transient Response vs Time (New Chip)
 VIN = 15V, VOUT = 1.25V, IL = 10mA to 500mA, CADJ = 0µF, COUT = 0µF
Figure 7-6 Load Transient Response vs Time (New Chip)