SLVS297Q April   2000  – July 2025 LM317M , LM317MQ

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics (Both Legacy and New Chip)
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Current Limit
      2. 6.3.2 Dropout Voltage (VDO)
      3. 6.3.3 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
  8. 7 Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1  Input and Output Capacitor Requirements (Legacy Chip)
        2. 7.2.2.2  Input and Output Capacitor Requirements (New Chip)
        3. 7.2.2.3  Feedback Resistors
        4. 7.2.2.4  Adjustment Pin Capacitor
        5. 7.2.2.5  Protection Diodes
        6. 7.2.2.6  Overload Recovery
        7. 7.2.2.7  Estimating Junction Temperature
        8. 7.2.2.8  Polarity Reversal Protection
        9. 7.2.2.9  Reverse Current
        10. 7.2.2.10 Power Dissipation (PD)
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Evaluation Module
      2. 8.1.2 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision P (February 2014) to Revision Q (July 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Deleted KTP package and information from documentGo
  • Changed entire document to align with current family formatGo
  • Added new silicon (M3) devices to documentGo
  • Added new silicon curves to Typical Characteristics section Go
  • Added Current Limit sectionGo
  • Changed LM317M to LM317M and LM317MQ in Protection Diodes sectionGo
  • Changed Power Supply Recommendations sectionGo
  • Added Device Nomenclature sectionGo

Changes from Revision O (July 2006) to Revision P (February 2014)

  • Updated document to new TI data sheet standards. Go
  • Removed Ordering Information Table Go