SNVSB55G February   2019  – September 2022 LM63615-Q1 , LM63625-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1.     Absolute Maximum Ratings
    2. 7.1 ESD Ratings
    3. 7.2 Recommended Operating Conditions
    4. 7.3 Thermal Information
    5. 7.4 Electrical Characteristics
    6. 7.5 Timing Characteristics
    7. 7.6 Switching Characteristics
    8. 7.7 System Characteristics
    9. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Sync/Mode Selection
      2. 8.3.2 Output Voltage Selection
      3. 8.3.3 Switching Frequency Selection
        1. 8.3.3.1 Spread Spectrum Option
      4. 8.3.4 Enable and Start-up
      5. 8.3.5 RESET Flag Output
      6. 8.3.6 Undervoltage Lockout and Thermal Shutdown and Output Discharge
    4. 8.4 Device Functional Modes
      1. 8.4.1 Overview
      2. 8.4.2 Light Load Operation
        1. 8.4.2.1 Sync/FPWM Operation
      3. 8.4.3 Dropout Operation
      4. 8.4.4 Minimum On-time Operation
      5. 8.4.5 Current Limit and Short-Circuit Operation
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Choosing the Switching Frequency
        2. 9.2.2.2 Setting the Output Voltage
          1. 9.2.2.2.1 CFF Selection
        3. 9.2.2.3 Inductor Selection
        4. 9.2.2.4 Output Capacitor Selection
        5. 9.2.2.5 Input Capacitor Selection
        6. 9.2.2.6 CBOOT
        7. 9.2.2.7 VCC
        8. 9.2.2.8 External UVLO
        9. 9.2.2.9 Maximum Ambient Temperature
      3. 9.2.3 Full Feature Design Example
      4. 9.2.4 Application Curves
      5. 9.2.5 EMI Performance Curves
    3. 9.3 What to Do and What Not to Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Ground and Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Glossary
    7. 12.7 Electrostatic Discharge Caution
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Absolute Maximum Ratings

Over the recommended junction temperature range (1)
PARAMETER MIN MAX UNIT
VIN to PGND (HTSSOP package) –0.3 40 V
VIN to PGND (WSON package) –0.3 42 V
EN to AGND (HTSSOP package) –0.3 40 V
EN to AGND (WSON package) –0.3 42 V
SYNC/MODE to AGND –0.3 6 V
VOUT_SEL and RT to AGND –0.3 5.5 V
RESET to AGND –0.3 16 V
FB to AGND (Fixed VOUT mode) –0.3 16 V
FB to AGND (Adjustable VOUT mode) –0.3 5.5 V
AGND to PGND –0.3 0.3 V
SW to PGND for transients of less than 10 ns (HTSSOP package) –6 40 V
SW to PGND for transients of less than 10 ns (WSON package) –6 42 V
BOOT to SW –0.3 5.5 V
VCC to AGND –0.3 5.5 V
TJ Junction temperature –40 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.