SNOS631E November   1994  – March 2025 LMC6061 , LMC6062 , LMC6064

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information: LMC6061
    5. 5.5 Thermal Information: LMC6062
    6. 5.6 Thermal Information: LMC6064
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Applications Information
      1. 6.1.1 Amplifier Topology
      2. 6.1.2 Compensating For Input Capacitance
      3. 6.1.3 Capacitive Load Tolerance
      4. 6.1.4 Latchup
    2. 6.2 Typical Applications
      1. 6.2.1 Instrumentation Amplifier
      2. 6.2.2 Low-Leakage Sample-and-Hold
      3. 6.2.3 1Hz Square-Wave Oscillator
    3. 6.3 Layout
      1. 6.3.1 Layout Guidelines
        1. 6.3.1.1 Printed Circuit Board Layout For High Impedance Work
      2. 6.3.2 Layout Example
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Thermal Information: LMC6062

THERMAL METRIC(1) LMC6062 UNIT
D (SOIC) P (PDIP)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 193.0 115.0 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 52.0 59.2 °C/W
RθJB Junction-to-board thermal resistance 56.9 43.2 °C/W
ψJT Junction-to-top characterization parameter 6.8 25.1 °C/W
ψJB Junction-to-board characterization parameter 56.1 42.3 °C/W
RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.