SLUSFB7
September 2023
LMG3624
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Switching Characteristics
7
Parameter Measurement Information
7.1
GaN Power FET Switching Parameters
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
GaN Power FET Switching Capability
8.3.2
Turn-On Slew-Rate Control
8.3.3
Current-Sense Emulation
8.3.4
Input Control Pins (EN, IN)
8.3.5
AUX Supply Pin
8.3.5.1
AUX Power-On Reset
8.3.5.2
AUX Under-Voltage Lockout (UVLO)
8.3.6
Overcurrent Protection
8.3.7
Overtemperature Protection
8.3.8
Fault Reporting
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
Turn-On Slew-Rate Design
9.2.2.2
Current-Sense Design
9.2.3
Application Curves
9.3
Power Supply Recommendations
9.4
Layout
9.4.1
Layout Guidelines
9.4.1.1
Solder-Joint Stress Relief
9.4.1.2
Signal-Ground Connection
9.4.1.3
CS Pin Signal
9.4.2
Layout Example
10
Device and Documentation Support
10.1
Documentation Support
10.1.1
Related Documentation
10.2
Receiving Notification of Documentation Updates
10.3
Support Resources
10.4
Trademarks
10.5
Electrostatic Discharge Caution
10.6
Glossary
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
REQ|38
MPQF705A
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slusfb7_oa
1
Features
650-V
170
-mΩ GaN power FET
Integrated gate driver with low propagation delays and adjustable turn-on slew-rate control
Current-sense emulation with high bandwidth and high accuracy
Cycle-by-cycle overcurrent protection
Overtemperature protection with
FLT
pin reporting
AUX quiescent current:
240
μA
AUX standby quiescent current: 50 μA
Maximum supply and input logic pin voltage: 26 V
8 mm × 5.3 mm QFN package with thermal pad