SNAS636C December 2013 – July 2021 LMK00338
The HCSL output buffer for Bank A and Bank B outputs can be separately disabled to Hi-Z using the CLKoutA_EN and CLKoutB_EN inputs, respectively, as shown in Table 8-3. For applications where all differential outputs are not needed, any unused output pin should be left floating with a minimum copper length (see note below) to minimize capacitance and potential coupling and reduce power consumption. If an entire output bank will not be used, TI recommends to disable and Hi-Z the bank to reduce power. Refer to Section 188.8.131.52 for more information on output interface and termination techniques.
For best soldering practices, the minimum trace length for any unused output pin should extend to include the pin solder mask. This way during reflow, the solder has the same copper area as connected pins. This allows for good, uniform fillet solder joints helping to keep the IC level during reflow.
|CLKoutX_EN||CLKoutX BUFFER TYPE |
(BANK A or B)