SNAS688C Februray   2017  – May 2018 LMK04832

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagram
    8. 6.8 Typical Characteristics – Clock Output AC Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Charge Pump Current Specification Definitions
      1. 7.1.1 Charge Pump Output Current Magnitude Variation vs Charge Pump Output Voltage
      2. 7.1.2 Charge Pump Sink Current vs Charge Pump Output Source Current Mismatch
      3. 7.1.3 Charge Pump Output Current Magnitude Variation vs Ambient Temperature
    2. 7.2 Differential Voltage Measurement Terminology
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1  Differences to LMK0482x
      2. 8.1.2  Jitter Cleaning
      3. 8.1.3  JEDEC JESD204B Support
      4. 8.1.4  Clock Inputs
        1. 8.1.4.1 Three Redundant PLL1 Reference Inputs
        2. 8.1.4.2 PLL2 Reference Inputs
        3. 8.1.4.3 Clock Distribution Reference Input
      5. 8.1.5  VCXO Buffered Output
      6. 8.1.6  Frequency Holdover
      7. 8.1.7  Internal VCOs
      8. 8.1.8  External VCO Mode
      9. 8.1.9  Clock Distribution
        1. 8.1.9.1 Clock Divider
        2. 8.1.9.2 High Performance Divider Bypass Mode
        3. 8.1.9.3 SYSREF Clock Divider
        4. 8.1.9.4 Device Clock Delay
        5. 8.1.9.5 Dynamic Digital Delay
        6. 8.1.9.6 SYSREF Delay: Global and Local
        7. 8.1.9.7 Programmable Output Formats
        8. 8.1.9.8 Clock Output Synchronization
      10. 8.1.10 0-Delay
      11. 8.1.11 Status Pins
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Synchronizing PLL R Dividers
        1. 8.3.1.1 PLL1 R Divider Synchronization
        2. 8.3.1.2 PLL2 R Divider Synchronization
      2. 8.3.2 SYNC/SYSREF
      3. 8.3.3 JEDEC JESD204B
        1. 8.3.3.1 How to Enable SYSREF
          1. 8.3.3.1.1 Setup of SYSREF Example
          2. 8.3.3.1.2 SYSREF_CLR
        2. 8.3.3.2 SYSREF Modes
          1. 8.3.3.2.1 SYSREF Pulser
          2. 8.3.3.2.2 Continuous SYSREF
          3. 8.3.3.2.3 SYSREF Request
      4. 8.3.4 Digital Delay
        1. 8.3.4.1 Fixed Digital Delay
          1. 8.3.4.1.1 Fixed Digital Delay Example
        2. 8.3.4.2 Dynamic Digital Delay
        3. 8.3.4.3 Single and Multiple Dynamic Digital Delay Example
      5. 8.3.5 SYSREF to Device Clock Alignment
      6. 8.3.6 Input Clock Switching
        1. 8.3.6.1 Input Clock Switching - Manual Mode
        2. 8.3.6.2 Input Clock Switching - Pin Select Mode
        3. 8.3.6.3 Input Clock Switching - Automatic Mode
      7. 8.3.7 Digital Lock Detect
        1. 8.3.7.1 Calculating Digital Lock Detect Frequency Accuracy
      8. 8.3.8 Holdover
        1. 8.3.8.1 Enable Holdover
          1. 8.3.8.1.1 Fixed (Manual) CPout1 Holdover Mode
          2. 8.3.8.1.2 Tracked CPout1 Holdover Mode
        2. 8.3.8.2 During Holdover
        3. 8.3.8.3 Exiting Holdover
        4. 8.3.8.4 Holdover Frequency Accuracy and DAC Performance
      9. 8.3.9 PLL2 Loop Filter
    4. 8.4 Device Functional Modes
      1. 8.4.1 DUAL PLL
        1. 8.4.1.1 Dual Loop
        2. 8.4.1.2 Dual Loop With Cascaded 0-Delay
        3. 8.4.1.3 Dual Loop With Nested 0-Delay
      2. 8.4.2 Single PLL
        1. 8.4.2.1 PLL2 Single Loop
        2. 8.4.2.2 PLL2 With External VCO
      3. 8.4.3 Distribution Mode
    5. 8.5 Programming
      1. 8.5.1 Recommended Programming Sequence
    6. 8.6 Register Maps
      1. 8.6.1 Register Map for Device Programming
      2. 8.6.2 Device Register Descriptions
        1. 8.6.2.1 System Functions
          1. 8.6.2.1.1 RESET, SPI_3WIRE_DIS
          2. 8.6.2.1.2 POWERDOWN
          3. 8.6.2.1.3 ID_DEVICE_TYPE
          4. 8.6.2.1.4 ID_PROD
          5. 8.6.2.1.5 ID_MASKREV
          6. 8.6.2.1.6 ID_VNDR
        2. 8.6.2.2 (0x100 - 0x138) Device Clock and SYSREF Clock Output Controls
          1. 8.6.2.2.1 DCLKX_Y_DIV
          2. 8.6.2.2.2 DCLKX_Y_DDLY
          3. 8.6.2.2.3 CLKoutX_Y_PD, CLKoutX_Y_ODL, CLKoutX_Y_IDL, DCLKX_Y_DDLY_PD, DCLKX_Y_DDLY[9:8], DCLKX_Y_DIV[9:8]
          4. 8.6.2.2.4 CLKoutX_SRC_MUX, CLKoutX_Y_PD, DCLKX_Y_BYP, DCLKX_Y_DCC, DCLKX_Y_POL, DCLKX_Y_HS
          5. 8.6.2.2.5 CLKoutY_SRC_MUX, SCLKX_Y_PD, SCLKX_Y_DIS_MODE, SCLKX_Y_POL, SCLKX_Y_HS
          6. 8.6.2.2.6 SCLKX_Y_ADLY_EN, SCLKX_Y_ADLY
          7. 8.6.2.2.7 SCLKX_Y_DDLY
          8. 8.6.2.2.8 CLKoutY_FMT, CLKoutX_FMT
        3. 8.6.2.3 SYSREF, SYNC, and Device Config
          1. 8.6.2.3.1  VCO_MUX, OSCout_MUX, OSCout_FMT
          2. 8.6.2.3.2  SYSREF_REQ_EN, SYNC_BYPASS, SYSREF_MUX
          3. 8.6.2.3.3  SYSREF_DIV
          4. 8.6.2.3.4  SYSREF_DDLY
          5. 8.6.2.3.5  SYSREF_PULSE_CNT
          6. 8.6.2.3.6  PLL2_RCLK_MUX, PLL2_NCLK_MUX, PLL1_NCLK_MUX, FB_MUX, FB_MUX_EN
          7. 8.6.2.3.7  PLL1_PD, VCO_LDO_PD, VCO_PD, OSCin_PD, SYSREF_GBL_PD, SYSREF_PD, SYSREF_DDLY_PD, SYSREF_PLSR_PD
          8. 8.6.2.3.8  DDLYdSYSREF_EN, DDLYdX_EN
          9. 8.6.2.3.9  DDLYd_STEP_CNT
          10. 8.6.2.3.10 SYSREF_CLR, SYNC_1SHOT_EN, SYNC_POL, SYNC_EN, SYNC_PLL2_DLD, SYNC_PLL1_DLD, SYNC_MODE
          11. 8.6.2.3.11 SYNC_DISSYSREF, SYNC_DISX
          12. 8.6.2.3.12 PLL1R_SYNC_EN, PLL1R_SYNC_SRC, PLL2R_SYNC_EN
        4. 8.6.2.4 (0x146 - 0x149) CLKin Control
          1. 8.6.2.4.1 CLKin_SEL_PIN_EN, CLKin_SEL_PIN_POL, CLKin2_EN, CLKin1_EN, CLKin0_EN, CLKin2_TYPE, CLKin1_TYPE, CLKin0_TYPE
          2. 8.6.2.4.2 CLKin_SEL_AUTO_REVERT_EN, CLKin_SEL_AUTO_EN, CLKin_SEL_MANUAL, CLKin1_DEMUX, CLKin0_DEMUX
          3. 8.6.2.4.3 CLKin_SEL0_MUX, CLKin_SEL0_TYPE
          4. 8.6.2.4.4 SDIO_RDBK_TYPE, CLKin_SEL1_MUX, CLKin_SEL1_TYPE
        5. 8.6.2.5 RESET_MUX, RESET_TYPE
        6. 8.6.2.6 (0x14B - 0x152) Holdover
          1. 8.6.2.6.1 LOS_TIMEOUT, LOS_EN, TRACK_EN, HOLDOVER_FORCE, MAN_DAC_EN, MAN_DAC[9:8]
          2. 8.6.2.6.2 MAN_DAC
          3. 8.6.2.6.3 DAC_TRIP_LOW
          4. 8.6.2.6.4 DAC_CLK_MULT, DAC_TRIP_HIGH
          5. 8.6.2.6.5 DAC_CLK_CNTR
          6. 8.6.2.6.6 CLKin_OVERRIDE, HOLDOVER_EXIT_MODE, HOLDOVER_PLL1_DET, LOS_EXTERNAL_INPUT, HOLDOVER_VTUNE_DET, CLKin_SWITCH_CP_TRI, HOLDOVER_EN
          7. 8.6.2.6.7 HOLDOVER_DLD_CNT
        7. 8.6.2.7 (0x153 - 0x15F) PLL1 Configuration
          1. 8.6.2.7.1 CLKin0_R
          2. 8.6.2.7.2 CLKin1_R
          3. 8.6.2.7.3 CLKin2_R
          4. 8.6.2.7.4 PLL1_N
          5. 8.6.2.7.5 PLL1_WND_SIZE, PLL1_CP_TRI, PLL1_CP_POL, PLL1_CP_GAIN
          6. 8.6.2.7.6 PLL1_DLD_CNT
          7. 8.6.2.7.7 HOLDOVER_EXIT_NADJ
          8. 8.6.2.7.8 PLL1_LD_MUX, PLL1_LD_TYPE
        8. 8.6.2.8 (0x160 - 0x16E) PLL2 Configuration
          1. 8.6.2.8.1 PLL2_R
          2. 8.6.2.8.2 PLL2_P, OSCin_FREQ, PLL2_REF_2X_EN
          3. 8.6.2.8.3 PLL2_N_CAL
          4. 8.6.2.8.4 PLL2_N
          5. 8.6.2.8.5 PLL2_WND_SIZE, PLL2_CP_GAIN, PLL2_CP_POL, PLL2_CP_TRI
          6. 8.6.2.8.6 PLL2_DLD_CNT
          7. 8.6.2.8.7 PLL2_LD_MUX, PLL2_LD_TYPE
        9. 8.6.2.9 (0x16F - 0x555) Misc Registers
          1. 8.6.2.9.1 PLL2_PRE_PD, PLL2_PD
          2. 8.6.2.9.2 PLL1R_RST
          3. 8.6.2.9.3 CLR_PLL1_LD_LOST, CLR_PLL2_LD_LOST
          4. 8.6.2.9.4 RB_PLL1_LD_LOST, RB_PLL1_LD, RB_PLL2_LD_LOST, RB_PLL2_LD
          5. 8.6.2.9.5 RB_DAC_VALUE (MSB), RB_CLKinX_SEL, RB_CLKinX_LOS
          6. 8.6.2.9.6 RB_DAC_VALUE
          7. 8.6.2.9.7 RB_HOLDOVER
          8. 8.6.2.9.8 SPI_LOCK
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Digital Lock Detect Frequency Accuracy
        1. 9.1.1.1 Minimum Lock Time Calculation Example
      2. 9.1.2 Driving CLKin AND OSCin Inputs
        1. 9.1.2.1 Driving CLKin and OSCin PINS With a Differential Source
        2. 9.1.2.2 Driving CLKin Pins With a Single-Ended Source
      3. 9.1.3 OSCin Doubler for Best Phase Noise Performance
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Device Selection
          1. 9.2.2.1.1 Clock Architect
        2. 9.2.2.2 Device Configuration and Simulation
        3. 9.2.2.3 Device Programming
      3. 9.2.3 Application Curves
    3. 9.3 Do's and Don'ts
      1. 9.3.1 Pin Connection Recommendations
  10. 10Power Supply Recommendations
    1. 10.1 Current Consumption
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Thermal Management
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 Clock Architect
        2. 12.1.1.2 PLLatinum Sim
        3. 12.1.1.3 TICS Pro
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.2.3 Device Programming

Using the clock design tools configuration the TICS Pro software is manually updated with this information to meet the required application.

Frequency planning for assignment of outputs:

  • To minimize crosstalk perform frequency planning / CLKout assignments to keep common frequencies on outputs close together.
  • It is best to place common device clock output frequencies on outputs sharing the same VCC group. For example, these outputs share Vcc4_CG2. Refer to Pin Configuration and Functions to see the VCC groupings the clock outputs.

In this example, the 245.76-MHz ADC output needs the best performance. CLKout2 on the LMK04832 provides the best noise floor / performance. The 245.76 MHz is placed on CLKout2 with 10.24-MHz SYSREF on CLKout3.

  • For best performance the input and output drive level bits may be set. Best noise floor performance is achieved with CLKout2_3_IDL = 1 and CLKout2_3_ODL = 1.
  • The CLKoutX_Y_ODL bit has no impact on even clock outputs in high performance bypass mode.

In this example, the 983.04-MHz DAC output is placed on CLKout4 and CLKout6 with 10.24-MHz SYSREF on paired CLKout5 and CLKout7 outputs.

  • These outputs share Vcc4_CG2.

In this example, the 122.88-MHz FPGA JESD204B output is placed on CLKout10 with 10.24-MHz SYSREF on paired CLKout11 output.

Additionally, the 122.88-MHz FPGA non-JESD204B outputs are placed on CLKout8 and CLKout9.

  • When frequency planning, consider PLL2 as a clock output at the phase detector frequency. As such, these 122.88-MHz outputs have been placed on the outputs close to the PLL2 and Charge Pump power supplies.

Once the device programming is completed as desired in the TICS Pro software, it is possible to export the register settings from the Register tab for use in application.