SLCS136V August   1999  – May 2025 LMV331 , LMV339 , LMV393

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics, VCC+ = 2.7V
    6. 5.6 Switching Characteristics, VCC+ = 2.7V
    7. 5.7 Electrical Characteristics, VCC+ = 5V
    8. 5.8 Switching Characteristics, VCC+ = 5V
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Voltage Comparison
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Voltage Range
        2. 7.2.2.2 Minimum Overdrive Voltage
        3. 7.2.2.3 Output and Drive Current
        4. 7.2.2.4 Response Time
      3. 7.2.3 Application Curves
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Related Links
  12. 11Trademarks
  13. 12Electrostatic Discharge Caution
  14. 13Glossary
  15. 14Revision History
  16. 15Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|5
  • DCK|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)LMV339LMV393LMV331UNIT
DPWRUCDDDUDGKPWDBVDCK
14 PINS8 PINS5 PINS
RθJAJunction-to-ambient thermal resistance136155216168210216222224238°C/W
RθJC(top)Junction-to-case (top) thermal resistance——51.3——————
RθJBJunction-to-board thermal resistance——59.0——————
ψJTJunction-to-top characterization parameter——1.2——————
ψJBJunction-to-board characterization parameter——59.0——————
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.