SGLS342D July   2006  – July 2025 LMV341-Q1 , LMV344-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Description
  4. 3Device Comparison Table
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 ESD Ratings
    4. 5.4 Electrical Characteristics 2.7V
    5. 5.5 Shutdown Characteristics 2.7V
    6. 5.6 Electrical Characteristics 5V
    7. 5.7 Shutdown Characteristics 5V
  7. 6Typical Characteristics
  8. 7Device and Documentation Support
    1. 7.1 Documentation Support
    2. 7.2 Receiving Notification of Documentation Updates
    3. 7.3 Support Resources
    4. 7.4 Trademarks
    5. 7.5 Electrostatic Discharge Caution
    6. 7.6 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Device Comparison Table

(1)
TA PACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3)
–40°C to 125°C SC-70 – DCK Reel of 3000 LMV341QDCKRQ1 RR_
SOT-23 – DBV Reel of 3000 LMV341QDBVRQ1 RCH_
TSSOP – PW Reel of 2000 LMV344IPWRQ1 LMV344Q
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.