SNAS783C June   2020  – February 2021 LMX2820

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Reference Oscillator Input
      2. 7.3.2  Input Path
        1. 7.3.2.1 Input Path Doubler (OSC_2X)
        2. 7.3.2.2 Pre-R Divider (PLL_R_PRE)
        3. 7.3.2.3 Programmable Input Multiplier (MULT)
        4. 7.3.2.4 R Divider (PLL_R)
      3. 7.3.3  PLL Phase Detector and Charge Pump
      4. 7.3.4  N Divider and Fractional Circuitry
        1. 7.3.4.1 Integer N Divide Portion (PLL_N)
        2. 7.3.4.2 Fractional N Divide Portion (PLL_NUM and PLL_DEN)
        3. 7.3.4.3 Modulator Order (MASH_ORDER)
      5. 7.3.5  LD Pin Lock Detect
      6. 7.3.6  MUXOUT Pin and Readback
      7. 7.3.7  Internal VCO
        1. 7.3.7.1 VCO Calibration
          1. 7.3.7.1.1 Determining the VCO Gain and Ranges
      8. 7.3.8  Channel Divider
      9. 7.3.9  Output Frequency Doubler
      10. 7.3.10 Output Buffer
      11. 7.3.11 Power-Down Modes
      12. 7.3.12 Phase Synchronization for Multiple Devices
        1. 7.3.12.1 SYNC Categories
        2. 7.3.12.2 Phase Adjust
          1. 7.3.12.2.1 Using MASH_SEED to Create a Phase Shift
          2. 7.3.12.2.2 Static vs. Dynamic Phase Adjust
          3. 7.3.12.2.3 Fine Adjustments to Phase Adjust
      13. 7.3.13 SYSREF
      14. 7.3.14 Fast VCO Calibration
      15. 7.3.15 Double Buffering (Shadow Registers)
      16. 7.3.16 Output Mute Pin and Ping Pong Approaches
    4. 7.4 Device Functional Modes
      1. 7.4.1 External VCO Mode
      2. 7.4.2 External Feedback Input Pins
        1. 7.4.2.1 PFDIN External Feedback Mode
        2. 7.4.2.2 RFIN External Feedback Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Treatment of Unused Pins
      2. 8.1.2 External Loop Filter
      3. 8.1.3 Using Instant Calibration
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Initialization and Power-on Sequencing
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Power Supply Recommendations

If fractional spurs are a large concern, using a ferrite bead to each of these power supply pins can reduce spurs to a small degree. This device has integrated LDOs, which improves the resistance to power supply noise. This device can be powered by an external DC-DC buck converter, such as the TPS62150. For the purposes of power supply filtering, it is useful to have a general idea of how much current goes through different pins. This may change significantly with configuration, but the following table gives a good idea.

Table 9-1 Current Consumption per Pin in mA
Conditoin Total VCCDIG VCCCP VCCMASH VCCBUF VCCVCO
One direct RF Output 420 23 5 5 124 263
One divided RF Output 580 21 13 96 212 238
One RF output with VCO doubler enabled 590 20 12 89 238 231
RFIN External Feedback Mode, Internal VCO 530 18 12 90 170 240
PFDIN External Feedback Mode, Internal VCO 455 18 10 79 110 238
External VCO Mode 290 19 9 92 54 116
Power-on reset current 234 10 6 48 24 146
Power-down current 10 2 0 1 6 1