SNVS667I February   2010  – March 2022 LMZ12010

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Overvoltage Protection
      2. 7.3.2 Current Limit
      3. 7.3.3 Thermal Protection
      4. 7.3.4 Prebiased Start-Up
    4. 7.4 Device Functional Modes
      1. 7.4.1 Discontinuous Conduction and Continuous Conduction Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Enable Divider, RENT, RENB, and RENH Selection
        2. 8.2.2.2 Output Voltage Selection
        3. 8.2.2.3 Soft-Start Capacitor Selection
        4. 8.2.2.4 Tracking Supply Divider Option
        5. 8.2.2.5 COUT Selection
        6. 8.2.2.6 CIN Selection
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Power Dissipation and Thermal Considerations
    4. 10.4 Power Module SMT Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Support Resources
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

Limits are for TJ = 25°C unless otherwise specified. Minimum and Maximum limits are ensured through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated the following conditions apply: VIN = 12 V, VOUT = 3.3 V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SYSTEM PARAMETERS
ENABLE CONTROL
VEN EN threshold VEN rising 1.274 V
Over the junction temperature (TJ) range of –40°C to +125°C 1.096 1.452
IEN-HYS EN hysteresis source current VEN > 1.274 V 13 µA
SOFT-START
ISS SS source current VSS = 0 V 50 µA
Over the junction temperature (TJ) range of –40°C to +125°C 40 60
tSS Internal soft-start interval 1.6 ms
CURRENT LIMIT
ICL Current limit threshold DC average 12.5 A
INTERNAL SWITCHING OSCILLATOR
fosc Free-running oscillator frequency 314 359 404 kHz
REGULATION AND OVERVOLTAGE COMPARATOR
VFB In-regulation feedback voltage VSS >+ 0.8 V
IO = 10 A
0.795 V
over the junction temperature (TJ) range of –40°C to +125°C 0.775 0.815
VFB-OV Feedback overvoltage protection threshold 0.86 V
IFB Feedback input bias current 5 nA
IQ Nonswitching quiescent current 3 mA
ISD Shutdown quiescent current VEN = 0 V 32 μA
Dmax Maximum duty factor 85%
THERMAL CHARACTERISTICS
TSD Thermal shutdown Rising 165 °C
TSD-HYST Thermal shutdown hysteresis Falling 15 °C
PERFORMANCE PARAMETERS(1)
ΔVO Output voltage ripple BW at 20 MHz 24 mVPP
ΔVO/ΔVIN Line regulation VIN = 12 V to 20 V, IOUT= 10 A ±0.2%
ΔVO/ΔIOUT Load regulation VIN = 12 V, IOUT= 0.001 A to 10 A 1 mV/A
η Peak efficiency VIN = 12 V, VOUT = 3.3 V, IOUT = 5 A 89.5%
η Full load efficiency VIN = 12 V, VOUT = 3.3 V, IOUT = 10 A 87.5%
EN 55022:2006, +A1:2007, FCC Part 15 Subpart B, tested on Evaluation Board with EMI configuration.