SNVS667I February   2010  – March 2022 LMZ12010

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Overvoltage Protection
      2. 7.3.2 Current Limit
      3. 7.3.3 Thermal Protection
      4. 7.3.4 Prebiased Start-Up
    4. 7.4 Device Functional Modes
      1. 7.4.1 Discontinuous Conduction and Continuous Conduction Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Enable Divider, RENT, RENB, and RENH Selection
        2. 8.2.2.2 Output Voltage Selection
        3. 8.2.2.3 Soft-Start Capacitor Selection
        4. 8.2.2.4 Tracking Supply Divider Option
        5. 8.2.2.5 COUT Selection
        6. 8.2.2.6 CIN Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
    3. 10.3 Power Dissipation and Thermal Considerations
    4. 10.4 Power Module SMT Guidelines
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Support Resources
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.3 Thermal Protection

The junction temperature of the LMZ12010 must not be allowed to exceed its maximum ratings. Thermal protection is implemented by an internal thermal shutdown circuit, which activates at 165°C (typical), causing the device to enter a low power standby state. In this state, the main MOSFET remains off, causing VOUT to fall, and the CSS capacitor is discharged to ground. Thermal protection helps prevent catastrophic failures for accidental device overheating. When the junction temperature falls back below 150°C (typical hysteresis = 15°C), the SS pin is released, VOUT rises smoothly, and normal operation resumes.

Applications requiring maximum output current, especially those at high input voltages, can require additional derating at elevated temperatures.