SBOSA42B June   2024  – December 2025 OPA2596 , OPA596

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information OPA596
    5. 5.5 Thermal Information OPA596
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 MUX-Friendly Inputs
      2. 6.3.2 Thermal Protection
      3. 6.3.3 Advanced Slew Boost
      4. 6.3.4 Overload Recovery
      5. 6.3.5 Full-Power Bandwidth Improved
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Bridge-Connected Piezoelectric Driver
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 DAC Output Gain and Buffer
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
      3. 7.2.3 Single-Supply Piezoelectric Driver
      4. 7.2.4 High-Side Current Sense
      5. 7.2.5 High-Voltage Instrumentation Amplifier
      6. 7.2.6 Composite Amplifier
    3. 7.3 Creepage and Clearance
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
        1. 7.5.1.1 Thermal Considerations
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3.5 Full-Power Bandwidth Improved

The full-power bandwidth curve has been a staple in data sheets for decades. The full-power bandwidth of an op amp provides some indication about where designers can expect slew-induced distortion on a signal of a given amplitude and frequency. The full-power bandwidth curve is generated using Equation 2.

Equation 2. F P B W = S R 2 π V O U T _ M A X

Figure 6-3 shows the full-power bandwidth of the OPAx596. The curve is a good reference for designers that need to achieve high-voltage, high-frequency output swings with little concern for distortion performance. Unfortunately, the curve provides little indication of the true distortion at any given point on the curve. The full-power bandwidth curve is, after all, only a theoretical value and slew-induced distortion appears gradually as the output nears the maximum rate of change. Furthermore, slew-induced distortion is only one of several sources of op-amp distortion. Therefore, the curve is a decent starting point, but not a reliable source for distortion performance.

Figure 6-4 shows the full power bandwidth in terms of total harmonic distortion (THD) performance for the OPAx596. This curve provides a better indication of the level of distortion that a designer can expect for a signal of a given amplitude and frequency. For example, the OPAx596 can achieve approximately −100dB or better of THD at 70VPP up to approximately 1kHz. As a second example, the OPAx596 can achieve approximately −130dB or better of THD at 10VPP up to about 1kHz. As a result of limitations in measurement bandwidth, only 20kHz data are recorded.

OPA596 OPA2596 Full-Power BandwidthFigure 6-3 Full-Power Bandwidth
OPA596 OPA2596 Full-Power Bandwidth ImprovedFigure 6-4 Full-Power Bandwidth Improved