SBOSA42B June   2024  – December 2025 OPA2596 , OPA596

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information OPA596
    5. 5.5 Thermal Information OPA596
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 MUX-Friendly Inputs
      2. 6.3.2 Thermal Protection
      3. 6.3.3 Advanced Slew Boost
      4. 6.3.4 Overload Recovery
      5. 6.3.5 Full-Power Bandwidth Improved
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Bridge-Connected Piezoelectric Driver
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 DAC Output Gain and Buffer
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
      3. 7.2.3 Single-Supply Piezoelectric Driver
      4. 7.2.4 High-Side Current Sense
      5. 7.2.5 High-Voltage Instrumentation Amplifier
      6. 7.2.6 Composite Amplifier
    3. 7.3 Creepage and Clearance
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
        1. 7.5.1.1 Thermal Considerations
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGK|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Thermal Information OPA596

THERMAL METRIC(1) OPA2596 UNIT
DGK (VSSOP)
8 PINS
RθJA Junction-to-ambient thermal resistance 143.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.4 °C/W
RθJB Junction-to-board thermal resistance 78.7 °C/W
ψJT Junction-to-top characterization parameter 3.0 °C/W
ψJB Junction-to-board characterization parameter 77.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.