SBOS982G June   2020  – July 2022 OPA2863 , OPA4863 , OPA863

PRODMIX  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information: OPA863
    5. 7.5  Thermal Information: OPA2863
    6. 7.6  Thermal Information: OPA4863
    7. 7.7  Electrical Characteristics: VS = 10 V
    8. 7.8  Electrical Characteristics: VS = 3 V
    9. 7.9  Typical Characteristics: VS = 10 V
    10. 7.10 Typical Characteristics: VS = 3 V
    11. 7.11 Typical Characteristics: VS = 3 V to 10 V
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Stage
      2. 8.3.2 Output Stage
        1. 8.3.2.1 Overload Power Limit
      3. 8.3.3 ESD Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Mode
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Low-Side Current Sensing
      1. 9.2.1 Design Requirements
    3. 9.3 Front-End Gain and Filtering
    4. 9.4 Low-Power SAR ADC Driver and Reference Buffer
    5. 9.5 Variable Reference Generator Using MDAC
    6. 9.6 Clamp-On Ultrasonic Flow Meter
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information: OPA2863

THERMAL METRIC(1) OPA2863 UNIT
DGK (VSSOP) D (SOIC) RUN (WQFN)
8 PINS 8 PINS 10 PINS
RθJA Junction-to-ambient thermal resistance 180.3 120.0 110.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 67.5 63.3 66.8 °C/W
RθJB Junction-to-board thermal resistance 101.9 63.2 43.6 °C/W
ΨJT Junction-to-top characterization parameter 9.8 17.2 2.9 °C/W
YJB Junction-to-board characterization parameter 100.1 62.5 43.5 °C/W
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.