SBOSAA7 September   2025 OPA598

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Current Limit
      2. 6.3.2 Overcurrent Flag
      3. 6.3.3 Overtemperature Flag
      4. 6.3.4 Enable and Disable
      5. 6.3.5 Mux-Friendly Inputs
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 High Voltage 2:1 Multiplexer With Unity Gain
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
      2. 7.2.2 Output Driver
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curve
      3. 7.2.3 Parallel Op Amps
      4. 7.2.4 Composite Amplifier
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Thermal Considerations
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 PSpice® for TI
        2. 8.1.1.2 TINA-TI™ Simulation Software (Free Download)
        3. 8.1.1.3 TI Precision Designs
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

OPA598 DNT Package, 12-Pin WSON (Top View)Figure 4-1 DNT Package, 12-Pin WSON (Top View)
Table 4-1 Pin Functions
PINTYPEDESCRIPTION
NAMENO.
Current Flag7OutputOvercurrent status flag
E/D12InputEnable and disable
E/D Com1InputEnable and disable common
–IN3InputInverting input
+IN4InputNoninverting input
ISET11—Current limit
NC2, 5—No internal connection
OUT 9Output Output
Thermal Flag8OutputOvertemperature status flag
Thermal Pad——The thermal pad is internally connected to V–. The thermal pad must be soldered to a printed-circuit board (PCB) connected to V–, even with applications that have low power dissipation.
V–6PowerNegative (lowest) power supply
V+ 10PowerPositive (highest) power supply