SLES023D December   2001  – December 2016 PCM1802

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
      1. 6.6.1 Typical Characteristics: Internal Filter
        1. 6.6.1.1 Digital Filter: Decimation Filter Frequency Response
        2. 6.6.1.2 HPF (High-Pass Filter) Frequency Response
        3. 6.6.1.3 Analog Filter: Antialiasing Filter Frequence Response
      2. 6.6.2 Typical Characteristics: Output Spectrum
      3. 6.6.3 Typical Characteristics: Supply Current
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Hardware Control
      2. 7.3.2 Power-On Reset Sequence
      3. 7.3.3 System Clock
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Down, HPF Bypass, Oversampling Control
      2. 7.4.2 Serial Audio Data Interface
        1. 7.4.2.1 Data Format
        2. 7.4.2.2 Interface Timing
        3. 7.4.2.3 Synchronization With Digital Audio System
      3. 7.4.3 Master Mode
      4. 7.4.4 Slave Mode
      5. 7.4.5 Interface Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Control Pins
        2. 8.2.2.2 DSP or Audio Processor
        3. 8.2.2.3 Input Filters
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 VCC and VDD Pins
      2. 10.1.2 AGND and DGND Pins
      3. 10.1.3 VIN Pins
      4. 10.1.4 VREF1 Pin
      5. 10.1.5 VREF2 Pin
      6. 10.1.6 DOUT Pin
      7. 10.1.7 System Clock
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.