SLES023D December   2001  – December 2016 PCM1802

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
      1. 6.6.1 Typical Characteristics: Internal Filter
        1. 6.6.1.1 Digital Filter: Decimation Filter Frequency Response
        2. 6.6.1.2 HPF (High-Pass Filter) Frequency Response
        3. 6.6.1.3 Analog Filter: Antialiasing Filter Frequence Response
      2. 6.6.2 Typical Characteristics: Output Spectrum
      3. 6.6.3 Typical Characteristics: Supply Current
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Hardware Control
      2. 7.3.2 Power-On Reset Sequence
      3. 7.3.3 System Clock
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Down, HPF Bypass, Oversampling Control
      2. 7.4.2 Serial Audio Data Interface
        1. 7.4.2.1 Data Format
        2. 7.4.2.2 Interface Timing
        3. 7.4.2.3 Synchronization With Digital Audio System
      3. 7.4.3 Master Mode
      4. 7.4.4 Slave Mode
      5. 7.4.5 Interface Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Control Pins
        2. 8.2.2.2 DSP or Audio Processor
        3. 8.2.2.3 Input Filters
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 VCC and VDD Pins
      2. 10.1.2 AGND and DGND Pins
      3. 10.1.3 VIN Pins
      4. 10.1.4 VREF1 Pin
      5. 10.1.5 VREF2 Pin
      6. 10.1.6 DOUT Pin
      7. 10.1.7 System Clock
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (January 2005) to D Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go
  • Deleted Lead temperature (soldering), 260°C for 5 s, from Absolute Maximum Ratings tableGo
  • Added Thermal Information tableGo
  • Changed Thermal resistance, RθJA, value in Thermal Information table From: 115°C/W To: 80.8°C/WGo