SBAS804G September   2017  – April 2026 REF34

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Solder Heat Shift
    2. 7.2 Long-Term Stability
    3. 7.3 Thermal Hysteresis
    4. 7.4 Power Dissipation
    5. 7.5 Noise Performance
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Supply Voltage
      2. 8.3.2 Low Temperature Drift
      3. 8.3.3 Load Current
    4. 8.4 Device Functional Modes
      1. 8.4.1 EN Pin
      2. 8.4.2 Negative Reference Voltage
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application: Basic Voltage Reference Connection
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input and Output Capacitors
        2. 9.2.2.2 4-Wire Kelvin Connections
        3. 9.2.2.3 VIN Slew Rate Considerations
        4. 9.2.2.4 Shutdown/Enable Feature
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Typical Characteristics

at TA = 25°C, VIN = VEN = 12V, IL = 0mA, CL = 10µF, CIN = 0.1µF (unless otherwise noted)

REF34 Temperature DriftFigure 6-1 Temperature Drift
REF34 Output Voltage Accuracy vs Temperature
Figure 6-3 Output Voltage Accuracy vs Temperature
REF34 Power Supply Rejection Ratio vs Frequency
Figure 6-5 Power Supply Rejection Ratio vs Frequency
REF34 Load Regulation Sourcing
A.
Figure 6-7 Load Regulation Sourcing
REF34 Noise Performance 10Hz to 10kHz
Figure 6-9 Noise Performance 10Hz to 10kHz
REF34 Load Transient
Figure 6-11 Load Transient
REF34 Load Transient
Figure 6-13 Load Transient
REF34 Line Transient
Figure 6-15 Line Transient
REF34 Thermal Hysteresis Distribution (Cycle 1)
Figure 6-17 Thermal Hysteresis Distribution (Cycle 1)
REF34 Solder Heat Shift Distribution
Refer to Section 7.1 for more information
Figure 6-19 Solder Heat Shift Distribution
REF34 0.1Hz to 10Hz Noise (VOUT)
A.
Figure 6-21 0.1Hz to 10Hz Noise (VOUT)
REF34 VIN vs IQ Over Temperature
 
Figure 6-2 VIN vs IQ Over Temperature
REF34 Quiescent Current vs Temperature
Figure 6-4 Quiescent Current vs Temperature
REF34 Line Regulation
A.
Figure 6-6 Line Regulation
REF34 Load Regulation Sinking
Figure 6-8 Load Regulation Sinking
REF34 Load Transient
 
Figure 6-10 Load Transient
REF34 Load Transient
Figure 6-12 Load Transient
REF34 Line Transient
Figure 6-14 Line Transient
REF34 Quiescent Current Shutdown Mode
Figure 6-16 Quiescent Current Shutdown Mode
REF34 Thermal Hysteresis Distribution (Cycle 2)
Figure 6-18 Thermal Hysteresis Distribution (Cycle 2)
REF34 Turn-on Time (Enable)
 
 
Figure 6-20 Turn-on Time (Enable)
REF34 Long Term Stability - 1000 hours (VOUT)
A.
Figure 6-22 Long Term Stability - 1000 hours (VOUT)