SBAS804G September   2017  – April 2026 REF34

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Solder Heat Shift
    2. 7.2 Long-Term Stability
    3. 7.3 Thermal Hysteresis
    4. 7.4 Power Dissipation
    5. 7.5 Noise Performance
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Supply Voltage
      2. 8.3.2 Low Temperature Drift
      3. 8.3.3 Load Current
    4. 8.4 Device Functional Modes
      1. 8.4.1 EN Pin
      2. 8.4.2 Negative Reference Voltage
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application: Basic Voltage Reference Connection
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input and Output Capacitors
        2. 9.2.2.2 4-Wire Kelvin Connections
        3. 9.2.2.3 VIN Slew Rate Considerations
        4. 9.2.2.4 Shutdown/Enable Feature
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Revision History

Changes from Revision F (June 2021) to Revision G (April 2026)

  • Moved the REF3425, REF3430, REF3433, REF3440, REF3450 devices to the REF30 product folder on TI.com and updated the datasheet headerGo
  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed Device Information table to Package Information Go
  • Moved the Voltage Reference Recommendation for Data Converters table from Applications to Device Comparison Go

Changes from Revision E (April 2021) to Revision F (June 2021)

  • Added low dropout line item to Features sectionGo
  • Consolidated part numbers in Device Information tableGo
  • Changed Thermal Information parameters to correctly reflect DBV packageGo
  • Added second cycle thermal hysteresis plotGo
  • Linked product numbers in table to datasheetsGo