SBAS804G September   2017  – April 2026 REF34

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Solder Heat Shift
    2. 7.2 Long-Term Stability
    3. 7.3 Thermal Hysteresis
    4. 7.4 Power Dissipation
    5. 7.5 Noise Performance
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Supply Voltage
      2. 8.3.2 Low Temperature Drift
      3. 8.3.3 Load Current
    4. 8.4 Device Functional Modes
      1. 8.4.1 EN Pin
      2. 8.4.2 Negative Reference Voltage
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application: Basic Voltage Reference Connection
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input and Output Capacitors
        2. 9.2.2.2 4-Wire Kelvin Connections
        3. 9.2.2.3 VIN Slew Rate Considerations
        4. 9.2.2.4 Shutdown/Enable Feature
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) REF34T REF34 UNIT
DBV DBV
6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 122.6 122.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 80.2 80.2 °C/W
RθJB Junction-to-board thermal resistance 42 42 °C/W
ΨJT Junction-to-top characterization parameter 23.2 23.2 °C/W
ΨJB Junction-to-board characterization parameter 41.9 41.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.