SCDS411D July   2019  – October 2022 SN3257-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dynamic Characteristics
    7. 6.7 Timing Requirements
    8.     Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  IPOFF Leakage Current
    5. 7.5  Transition Time
    6. 7.6  tON (EN) and tOFF (EN) Time
    7. 7.7  tON (VDD) and tOFF (VDD) Time
    8. 7.8  Break-Before-Make Delay
    9. 7.9  Propagation Delay
    10. 7.10 Skew
    11. 7.11 Charge Injection
    12. 7.12 Capacitance
    13. 7.13 Off Isolation
    14. 7.14 Channel-to-Channel Crosstalk
    15. 7.15 Bandwidth
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Beyond Supply Operation
      3. 8.3.3 1.8 V Logic Compatible Inputs
      4. 8.3.4 Powered-off Protection
      5. 8.3.5 Fail-Safe Logic
      6. 8.3.6 Integrated Pull-Down Resistors
    4. 8.4 Device Functional Modes
      1. 8.4.1 Truth Tables
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The SN3257-Q1 is an automotive grade complementary metal-oxide semiconductor (CMOS) switch that supports high speed signals with low propagation delay. The SN3257-Q1 offers a 2:1 (SPDT) switch configuration with 4-channels making it ideal for multi-lane protocols such as SPI and I2S. The device supports bidirectional analog and digital signals on the source (SxA, SxB) and drain (Dx) pins and can pass signals above supply up to VDD x 2, with a maximum input and output voltage of 5.5 V.

The SN3257-Q1 has an active low EN pin that is used to enable and disable all channels simultaneously. When the EN pin is LOW, one of the two switch paths is selected based on the state of SEL pin.

Powered-off protection up to 3.6 V on the signal path of the SN3257-Q1 provides isolation when the supply voltage is removed (VDD = 0 V). Without this protection feature, switches can back-power the supply rail through an internal ESD diode and cause potential damage to the system.

Fail-safe logic circuitry allows voltages on the logic control pins to be applied before the supply pin, protecting the device from potential damage. Both logic control inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility. Integrated pull down resistor on the logic pins removes external components to reduce system size and cost.

Package Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
SN3257-Q1 PW (TSSOP, 16) 5.00 mm × 4.40 mm
DYY (SOT-23-THIN,16) 4.20 mm × 2.00 mm
(1) For all available packages, see the package option addendum at the end of the data sheet.
GUID-0B7A7BD2-FBCC-4888-9829-5C74ED0A0AB9-low.gif Block Diagram