2:1 (SPDT), 4-channel switch with 1.8-V logic
Product details
Parameters
Package | Pins | Size
Features
- AEC-Q100 qualified for automotive application
- Temperature grade 1: -40°C to +125°C, TA
- Wide supply range: 1.5 V to 5.5 V
- Low propagation delay: 78 ps
- Low on-resistance: 5 Ω
- High bandwidth: 1.2 GHz
- Bidirectional Signal Path
- Supports Input Voltage Beyond Supply
- 1.8 V Logic Compatible
- Integrated Pull Down Resistor on Logic Pins
- Fail-Safe Logic
- Powered-off Protection up to 3.6 V Signals
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Description
The SN3257-Q1 is an automotive grade complementary metal-oxide semiconductor (CMOS) switch that supports high speed signals with low propagation delay. The SN3257-Q1 offers a 2:1 (SPDT) switch configuration with 4-channels making it ideal for multi-lane protocols such as SPI and I2S. The device supports bidirectional analog and digital signals on the source (SxA, SxB) and drain (Dx) pins and can pass signals above supply up to VDD x 2, with a maximum input and output voltage of 5.5 V.
The SN3257-Q1 has an active low EN pin that is used to enable and disable all channels simultaneously. When the EN pin is LOW, one of the two switch paths is selected based on the state of SEL pin.
Powered-off protection up to 3.6 V on the signal path of the SN3257-Q1 provides isolation when the supply voltage is removed (VDD = 0 V). Without this protection feature, switches can back-power the supply rail through an internal ESD diode and cause potential damage to the system.
Fail-safe logic circuitry allows voltages on the logic control pins to be applied before the supply pin, protecting the device from potential damage. Both logic control inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility. Integrated pull down resistor on the logic pins removes external components to reduce system size and cost.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | SN3257-Q1 5-V, Low Propagation Delay, 2:1 (SPDT), 4-Channel Switch with 1.8 V Logic datasheet (Rev. B) | Jan. 30, 2020 |
Technical articles | Overcome last-minute requirement changes with SOT-23 multiplexers | Sep. 18, 2020 | |
Application note | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
Application note | Multiplexers and Signal Switches Glossary | Mar. 06, 2020 | |
Functional safety information | SN3257-Q1 Functional Safety FIT Rate, FMD and Pin FMA | Feb. 18, 2020 | |
User guide | 16DYYPWEVM Test board for SOT-23 THIN (DYY) and TSSOP (PW) packages User's Guide | Nov. 11, 2019 | |
Technical articles | Roll with the design punches and overcome power-sequencing challenges | Jul. 29, 2019 | |
Application note | Enabling SPI-based flash memory expansion by using multiplexers | Jan. 17, 2019 | |
Application note | Eliminate power Sequencing with powered-off protection signal switches (Rev. B) | Jan. 15, 2019 | |
Application note | 1.8 V Logic for Muxes and Signal | May 16, 2018 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Features
- Dual footprint of SOT-23 THIN (DYY) and TSSOP (PW) packages
- Quick prototyping and testing of 16 pin IC in SOT-23 THIN (DYY) and TSSOP (PW) packages
- All 16 signals paths include 0603 pads for pull-up, pull-down, or load-capacitors
- Test site with 3 SMB connectors for high speed evalauation for TMUX1574 (...)
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Design tools & simulation
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
SOT-23-THN (DYY) | 16 | View options |
TSSOP (PW) | 16 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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