SCDS411D July   2019  – October 2022 SN3257-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dynamic Characteristics
    7. 6.7 Timing Requirements
    8.     Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  IPOFF Leakage Current
    5. 7.5  Transition Time
    6. 7.6  tON (EN) and tOFF (EN) Time
    7. 7.7  tON (VDD) and tOFF (VDD) Time
    8. 7.8  Break-Before-Make Delay
    9. 7.9  Propagation Delay
    10. 7.10 Skew
    11. 7.11 Charge Injection
    12. 7.12 Capacitance
    13. 7.13 Off Isolation
    14. 7.14 Channel-to-Channel Crosstalk
    15. 7.15 Bandwidth
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Beyond Supply Operation
      3. 8.3.3 1.8 V Logic Compatible Inputs
      4. 8.3.4 Powered-off Protection
      5. 8.3.5 Fail-Safe Logic
      6. 8.3.6 Integrated Pull-Down Resistors
    4. 8.4 Device Functional Modes
      1. 8.4.1 Truth Tables
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Support Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.8 Typical Characteristics

At TA = 25°C, VDD = 3.3 V (unless otherwise noted).

GUID-8FA4E0A8-6D15-4774-928D-EBEFF8F8A306-low.gif
TA = 25°C
Figure 6-1 On-Resistance vs Source or Drain Voltage
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VDD = 3.3 V
Figure 6-3 On-Resistance vs Source or Drain Voltage
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TA = 25°C
Figure 6-5 Supply Current vs Logic Voltage
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TA = 25°C
Figure 6-7 IPOFF Leakage vs Source or Drain Voltage
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TA = 25°C
RL= 200 Ω
Figure 6-9 IPOFF Leakage vs Source or Drain Voltage
GUID-168D997E-2DC1-4795-8210-F03C44ED3242-low.gif
VDD = 5.5 V
Figure 6-11 TTRANSITION vs Temperature
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TA = 25°C
Figure 6-13 TOFF (EN) vs Supply Voltage
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TA = 25°C
VDD = 3.3 V
Figure 6-15 Off Isolation and Crosstalk vs Frequency
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VDD = 5.5 V
Figure 6-2 On-Resistance vs Source or Drain Voltage
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VDD = 1.5 V
Figure 6-4 On-Resistance vs Source or Drain Voltage
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Figure 6-6 Supply Current vs Supply Voltage
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VSource = 3.6 V
VDrain = 0 V
Figure 6-8 IPOFF Leakage vs Temperature
GUID-FE27E815-66D5-4329-87C6-150606964A52-low.gif
TA = 25°C
Figure 6-10 TTRANSITION vs Supply Voltage
GUID-A9670EE5-47AB-4E5E-A9CF-D1CA5ECCE284-low.gif
TA = 25°C
Figure 6-12 TON (EN) vs Supply Voltage
GUID-2D150FCD-534B-4D19-B3A4-AD38B0162C71-low.gif
TA = 25°C
Figure 6-14 Skew and Propagation Delay vs Supply Voltage
GUID-FD6F16C0-1CB3-4518-86E5-D00A14DDA0E0-low.gif
TA = 25°C
VDD = 1.5 V to 5.5 V
Figure 6-16 On-Response vs Frequency