SLLS301R APRIL   1998  – January 2016 SN65LVDS050 , SN65LVDS051 , SN65LVDS179 , SN65LVDS180

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Device Options
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Device Electrical Characteristics
    6. 8.6  Driver Electrical Characteristics
    7. 8.7  Receiver Electrical Characteristics
    8. 8.8  Driver Switching Characteristics
    9. 8.9  Receiver Switching Characteristics
    10. 8.10 Typical Characteristics
  9. 9 Parameter Measurement Information
    1. 9.1 Driver
    2. 9.2 Receiver
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Driver Offset
      2. 10.3.2 5-V Input Tolerance
      3. 10.3.3 NC Pins
      4. 10.3.4 Driver Equivalent Schematics
      5. 10.3.5 Receiver Features
        1. 10.3.5.1 Receiver Output States
        2. 10.3.5.2 Receiver Open-Circuit Fail-Safe
        3. 10.3.5.3 Receiver Power-On Reset
        4. 10.3.5.4 Common-Mode Range vs Supply Voltage
        5. 10.3.5.5 General Purpose Comparator
        6. 10.3.5.6 Receiver Equivalent Schematics
    4. 10.4 Device Functional Modes
      1. 10.4.1 Function Tables
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Equipment
        2. 11.2.2.2 Driver Supply Voltage
        3. 11.2.2.3 Driver Bypass Capacitance
        4. 11.2.2.4 Driver Output Voltage
        5. 11.2.2.5 Interconnecting Media
        6. 11.2.2.6 PCB Transmission Lines
        7. 11.2.2.7 Termination Resistor
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
      1. 13.1.1 Microstrip vs. Stripline Topologies
      2. 13.1.2 Dielectric Type and Board Construction
      3. 13.1.3 Recommended Stack Layout
      4. 13.1.4 Separation Between Traces
      5. 13.1.5 Crosstalk and Ground Bounce Minimization
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Device Support
      1. 14.1.1 Third-Party Products Disclaimer
      2. 14.1.2 Other LVDS Products
    2. 14.2 Documentation Support
      1. 14.2.1 Related Information
    3. 14.3 Related Links
    4. 14.4 Trademarks
    5. 14.5 Electrostatic Discharge Caution
    6. 14.6 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

15 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.