SLLS301R APRIL   1998  – January 2016 SN65LVDS050 , SN65LVDS051 , SN65LVDS179 , SN65LVDS180

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Device Options
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Device Electrical Characteristics
    6. 8.6  Driver Electrical Characteristics
    7. 8.7  Receiver Electrical Characteristics
    8. 8.8  Driver Switching Characteristics
    9. 8.9  Receiver Switching Characteristics
    10. 8.10 Typical Characteristics
  9. 9 Parameter Measurement Information
    1. 9.1 Driver
    2. 9.2 Receiver
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Driver Offset
      2. 10.3.2 5-V Input Tolerance
      3. 10.3.3 NC Pins
      4. 10.3.4 Driver Equivalent Schematics
      5. 10.3.5 Receiver Features
        1. 10.3.5.1 Receiver Output States
        2. 10.3.5.2 Receiver Open-Circuit Fail-Safe
        3. 10.3.5.3 Receiver Power-On Reset
        4. 10.3.5.4 Common-Mode Range vs Supply Voltage
        5. 10.3.5.5 General Purpose Comparator
        6. 10.3.5.6 Receiver Equivalent Schematics
    4. 10.4 Device Functional Modes
      1. 10.4.1 Function Tables
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Equipment
        2. 11.2.2.2 Driver Supply Voltage
        3. 11.2.2.3 Driver Bypass Capacitance
        4. 11.2.2.4 Driver Output Voltage
        5. 11.2.2.5 Interconnecting Media
        6. 11.2.2.6 PCB Transmission Lines
        7. 11.2.2.7 Termination Resistor
      3. 11.2.3 Application Curves
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
      1. 13.1.1 Microstrip vs. Stripline Topologies
      2. 13.1.2 Dielectric Type and Board Construction
      3. 13.1.3 Recommended Stack Layout
      4. 13.1.4 Separation Between Traces
      5. 13.1.5 Crosstalk and Ground Bounce Minimization
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Device Support
      1. 14.1.1 Third-Party Products Disclaimer
      2. 14.1.2 Other LVDS Products
    2. 14.2 Documentation Support
      1. 14.2.1 Related Information
    3. 14.3 Related Links
    4. 14.4 Trademarks
    5. 14.5 Electrostatic Discharge Caution
    6. 14.6 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Specifications

8.1 Absolute Maximum Ratings(1)

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC(2) Supply voltage range –0.5 4 V
Voltage range: D, R, DE, RE –0.5 6 V
Y, Z, A, and B –0.5 4 V
|VOD| Differential output voltage 1 V
Continuous power dissipation See Thermal Information
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values, except differential I/O bus voltages are with respect to network ground terminal.

8.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Y, Z, A, B , and GND (see (1)) Class 3, A ±12000 V
Class 3, B ±600 V
All Class 3, A ±7000 V
Class 3, B ±500 V
Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds 250 °C
(1) Tested in accordance with MIL-STD-883C Method 3015.7.

8.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VCC Supply voltage 3 3.3 3.6 V
VIH High-level input voltage 2 V
VIL Low-level input voltage 0.8 V
|VID| Magnitude of differential input voltage 0.05 0.6 V
|VOD(dis)| Magnitude of differential output voltage with disabled driver 520 mV
VOY or VOZ Driver output voltage 0 2.4 V
VIC Common-mode input voltage (see Figure 14) VCC – 0.8 V
TA Operating free-air temperature –40 85 °C

8.4 Thermal Information

THERMAL METRIC(1) SN65LVDS179 SN65LVDS180 SN65LVDS050, SN65LVDS051 UNIT
D DGK D PW D PW
8 PINS 14 PINS 16 PINS
Power Rating: TA≤ 25°C 635 424 987 736 1110 839 mW
Derating Factor Above TA = 25°C(2) 5.1 3.4 7.9 5.9 8.9 6.7 mW/°C
Power Rating: TA = 85°C 330 220 513 383 577 437
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) This is the inverse of the junction-to-ambient thermal resistance when board-mounted and with no airflow.

8.5 Device Electrical Characteristics

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
ICC Supply current SN65LVDS179 No receiver load, driver RL = 100 Ω 9 12 mA
SN65LVDS180 Driver and receiver enabled, no receiver load, driver RL = 100 Ω 9 12 mA
Driver enabled, receiver disabled, RL = 100 Ω 5 7
Driver disabled, receiver enabled, no load 1.5 2
Disabled 0.5 1
SN65LVDS050 Drivers and receivers enabled, no receiver loads, driver RL = 100 Ω 12 20 mA
Drivers enabled, receivers disabled, RL = 100 Ω 10 16
Drivers disabled, receivers enabled, no loads 3 6
Disabled 0.5 1
SN65LVDS051 Drivers enabled, no receiver loads, driver RL = 100 Ω 12 20 mA
Drivers disabled, no loads 3 6
(1) All typical values are at 25°C and with a 3.3-V supply.

8.6 Driver Electrical Characteristics

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
|VOD| Differential output voltage magnitude RL = 100 Ω, See Figure 11 and Figure 12 247 340 454 mV
Δ|VOD| Change in differential output voltage magnitude between logic states –50 50
VOC(SS) Steady-state common-mode output voltage See Figure 12 1.125 1.2 1.375 V
ΔVOC(SS) Change in steady-state common-mode output voltage between logic states –50 50 mV
VOC(PP) Peak-to-peak common-mode output voltage 50 150 mV
IIH High-level input current DE VIH = 5 V –0.5 –20 μA
D 2 20
IIL Low-level input current DE VIL = 0.8 V –0.5 –10 μA
D 2 10
IOS Short-circuit output current VOY or VOZ = 0 V 3 10 mA
VOD = 0 V 3 10
IO(OFF) Off-state output current DE = 0 V
VOY = VOZ = 0 V		 –1 1 µA
DE = VCC
VOY = VOZ = 0 V
VCC < 1.5 V
CIN Input capacitance 3 pF

8.7 Receiver Electrical Characteristics

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
VIT+ Positive-going differential input voltage threshold See Figure 14 and Table 2 100 mV
VIT– Negative-going differential input voltage threshold –100
VOH High-level output voltage IOH = –8 mA 2.4 V
IOH = –4 mA 2.8
VOL Low-level output voltage IOL = 8 mA 0.4 V
II Input current (A or B input) VI = 0 V –2 –11 –20 μA
VI = 2.4 V –1.2 –3
II(OFF) Power-off input current (A or B input) VCC = 0 V ±20 μA
IIH High-level input current (enables) VIH = 5 V ±10 μA
IIL Low-level input current (enables) VIL = 0.8 V ±10 μA
IOZ High-impedance output current VO = 0 or 5 V ±10 μA
CI Input capacitance 5 pF
(1) All typical values are at 25°C and with a 3.3-V supply.

8.8 Driver Switching Characteristics

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
tPLH Propagation delay time, low-to-high-level output RL = 100 Ω
CL = 10 pF
See Figure 11 		1.7 2.7 ns
tPHL Propagation delay time, high-to-low-level output 1.7 2.7 ns
tr Differential output signal rise time 0.8 1 ns
tf Differential output signal fall time 0.8 1 ns
tsk(p) Pulse skew (|tpHL – tpLH|)(2) 300 ps
tsk(o) Channel-to-channel output skew(3) 150 ps
ten Enable time See Figure 13 4.3 10 ns
tdis Disable time 3.1 10 ns
(1) All typical values are at 25°C and with a 3.3-V supply.
(2) tsk(p) is the magnitude of the time difference between the high-to-low and low-to-high propagation delay times at an output.
(3) tsk(o) is the magnitude of the time difference between the outputs of a single device with all of their inputs connected together.

8.9 Receiver Switching Characteristics

over recommended operating conditions (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP(1) MAX UNIT
tPLH Propagation delay time, low-to-high-level output CL = 10 pF,
See Figure 15 		3.7 4.5 ns
tPHL Propagation delay time, high-to-low-level output 3.7 4.5 ns
tsk(p) Pulse skew (|tpHL – tpLH|)(2) 0.3 ns
tr Output signal rise time 0.7 1.5 ns
tf Output signal fall time 0.9 1.5 ns
tPZH Propagation delay time, high-impedance-to-high-level output See Figure 16 2.5 ns
tPZL Propagation delay time, high-impedance-to-low-level output 2.5 ns
tPHZ Propagation delay time, high-level-to-high-impedance output 7 ns
tPLZ Propagation delay time, low-level-to-high-impedance output 4 ns
(1) All typical values are at 25°C and with a 3.3-V supply.
(2) tsk(p) is the magnitude of the time difference between the high-to-low and low-to-high propagation delay times at an output.

8.10 Typical Characteristics

SN65LVDS179 SN65LVDS180 SN65LVDS050 SN65LVDS051 tc_involt_lls301.gif Figure 1. Disabled Driver Output Current vs Output Voltage
SN65LVDS179 SN65LVDS180 SN65LVDS050 SN65LVDS051 tc_houtv_lls301.gif Figure 3. Driver High-Level Output Voltage vs High-Level Output Current
SN65LVDS179 SN65LVDS180 SN65LVDS050 SN65LVDS051 tc_rhvolt_lls301.gif Figure 5. Receiver High-Level Output Voltage vs High-Level Output Current
SN65LVDS179 SN65LVDS180 SN65LVDS050 SN65LVDS051 tc_ldtemp_lls301.gif Figure 7. Driver Low-to-High Level Propagation Delay Time vs Free-Air Temperature
SN65LVDS179 SN65LVDS180 SN65LVDS050 SN65LVDS051 tc_rltemp2_lls301.gif Figure 9. Receiver Low-to-High Level Propagation Delay Time vs Free-Air Temperature
SN65LVDS179 SN65LVDS180 SN65LVDS050 SN65LVDS051 tc_outvolt_lls301.gif Figure 2. Driver Low-Level Output Voltage vs Low-Level Output Current
SN65LVDS179 SN65LVDS180 SN65LVDS050 SN65LVDS051 tc_loutv_lls301.gif Figure 4. Receiver Low-Level Output Voltage vs Low-Level Output Current
SN65LVDS179 SN65LVDS180 SN65LVDS050 SN65LVDS051 tc_hdtemp_lls301.gif Figure 6. Driver High-to-Low Level Propagation Delay Time vs Free-Air Temperature
SN65LVDS179 SN65LVDS180 SN65LVDS050 SN65LVDS051 tc_rhtemp2_lls301.gif Figure 8. Receiver High-to-Low Level Propagation Delay Time vs Free-Air Temperature