SLLS881G December   2007  – October 2014 SN65LVDS315

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Device Electrical Characteristics
    6. 6.6 Output Electrical Characteristics
    7. 6.7 Input Electrical Characteristics
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Typical Blanking Power Consumption Test Pattern
    2. 7.2 Maximum Power Consumption Test Pattern
    3. 7.3 Jitter Performance
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Frame Counter Size
      2. 8.3.2 Data Formats
      3. 8.3.3 Parallel Input Port Timing Information
      4. 8.3.4 MIPI CSI-1 / CCP2-Class 0 Interface
      5. 8.3.5 Frame Structure and Synchronization Codes
      6. 8.3.6 Preventing Wrong Synchronization
      7. 8.3.7 Frame Structure
      8. 8.3.8 VS and HS Timing to Generate the Correct Control Signals
    4. 8.4 Device Functional Modes
      1. 8.4.1 Powerdown Modes
        1. 8.4.1.1 Shutdown Mode
        2. 8.4.1.2 Standby Mode
      2. 8.4.2 Active Modes
        1. 8.4.2.1 Acquire Mode (PLL Approaches Lock)
        2. 8.4.2.2 Transmit Mode
      3. 8.4.3 Status Detect and Operating Modes Flow Diagram
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Receiver Termination Requirement
      2. 9.1.2 Preventing Control Inputs From Increased Leakage Currents
    2. 9.2 Typical Application
      1. 9.2.1 VGA Camera Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Calculation Example: VGA Camera Sensor
          2. 9.2.1.2.2 Typical Application Frequencies
            1. 9.2.1.2.2.1 8-Bit Camera Application
        3. 9.2.1.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Trademarks

All other trademarks are the property of their respective owners.

12.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.3 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.