SCLS175H march   2003  – august 2023 SN54HCT244 , SN74HCT244

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - SN54HCT244
    6. 6.6  Electrical Characteristics - SN74HCT244
    7. 6.7  Switching Characteristics: SN54HCT244
    8. 6.8  Switching Characteristics: SN74HCT244
    9. 6.9  Operating Characteristics
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|20
  • NS|20
  • N|20
  • DGS|20
  • DW|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRICSN74HCT244UNIT
DW (SOIC)DB (SSOP)N (PDIP)NS (SO)PW (TSSOP)DGS (VSSOP)
20 PINS20 PINS20 PINS20 PINS20 PINS20 PINS
RθJAJunction-to-ambient thermal resistance(1)109.1122.784.6113.4131.8130.6°C/W
RθJC (top)Junction-to-case (top) thermal resistance7681.672.578.672.268.7°C/W
RθJBJunction-to-board thermal resistance77.677.565.378.482.885.4°C/W
ΨJTJunction-to-top characterization parameter51.546.155.347.121.510.5°C/W
ΨJBJunction-to-board characterization parameter77.177.165.278.182.485.0°C/W
RθJC (bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/AN/AN/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.