SCLS175H march   2003  – august 2023 SN54HCT244 , SN74HCT244

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - SN54HCT244
    6. 6.6  Electrical Characteristics - SN74HCT244
    7. 6.7  Switching Characteristics: SN54HCT244
    8. 6.8  Switching Characteristics: SN74HCT244
    9. 6.9  Operating Characteristics
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DB|20
  • NS|20
  • N|20
  • DGS|20
  • DW|20
  • PW|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision G (December 2022) to Revision H (August 2023)

  • Added supporting information for the DGS (SOT) packageGo
  • Updated the Device Information table to include ratingGo
  • Removed the W (CFP, 20) package from the data sheetGo

Changes from Revision F (May 2022) to Revision G (December 2022)

  • Added DGS (SOT) package informationGo
  • Added DGS (SOT) package informationGo
  • Added DGS (SOT) package thermal informationGo

Changes from Revision E (August 2016) to Revision F (May 2022)

  • Junction-to-ambient thermal resistance values increased. DW was 76.6 is now 109.1, DB was 89.4 is now 122.7, N was 44.8 is now 84.6, NS was 71.8 is now 113.4, PW was 97.4 is now 131.8Go

Changes from Revision D (August 2013) to Revision E (August 2016)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Deleted Ordering Information table; see POA at the end of the data sheetGo
  • Changed Thermal Information tableGo
  • Added ESD warningGo