SCES351Y July   2001  – October 2025 SN74LVC1G17

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics—DC Limit Changes
    6. 5.6  Switching Characteristics, CL = 15pF
    7. 5.7  Switching Characteristics AC Limit, –40°C to 85°C
    8. 5.8  Switching Characteristics AC Limit, –40°C to 125°C
    9. 5.9  Operating Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DPW|5
  • DBV|5
  • DSF|6
  • YZT|4
  • DCK|5
  • YZV|4
  • DRL|5
  • DRY|6
  • YZP|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)SN74LVC1G17UNIT
DBVDCKDRLDRYYZPDPWYZV
5 PINS5 PINS5 PINS6 PINS5 PINS4 PINS4 PINS
RθJAJunction-to-ambient thermal resistance357.1371.0350608130340181°C/W
RθJC(top)Junction-to-case (top) thermal resistance263.7297.5121432542151
RθJBJunction-to-board thermal resistance264.4258.61714465129439
ψJTJunction-to-top characterization parameter195.6195.6111911418
ψJBJunction-to-board characterization parameter262.2256.21694425029438
RθJC(bot)Junction-to-case (bottom) thermal resistance–––198–250–
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.