SLASFD9 April   2025 TAC5301-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Electrical Characteristics
    7. 5.7  Timing Requirements: I2C Interface
    8. 5.8  Switching Characteristics: I2C Interface
    9. 5.9  Timing Requirements: TDM, I2S or LJ Interface
    10. 5.10 Switching Characteristics: TDM, I2S or LJ Interface
    11. 5.11 Timing Diagrams
    12. 5.12 Typical Charactaristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Serial Interfaces
        1. 6.3.1.1 Control Serial Interfaces
        2. 6.3.1.2 Audio Serial Interfaces
          1. 6.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 6.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 6.3.1.2.3 Left-Justified (LJ) Interface
        3. 6.3.1.3 Using Multiple Devices With Shared Buses
      2. 6.3.2 Phase-Locked Loop (PLL) and Clock Generation
      3. 6.3.3 Input Channel Configuration
      4. 6.3.4 Output Channel Configurations
      5. 6.3.5 Reference Voltage
      6. 6.3.6 Microphone Bias
      7. 6.3.7 Signal-Chain Processing
        1. 6.3.7.1 ADC Signal-Chain
          1. 6.3.7.1.1  Programmable Channel Gain and Digital Volume Control
          2. 6.3.7.1.2  Programmable Channel Gain Calibration
          3. 6.3.7.1.3  Programmable Channel Phase Calibration
          4. 6.3.7.1.4  Programmable Digital High-Pass Filter
          5. 6.3.7.1.5  Programmable Digital Biquad Filters
          6. 6.3.7.1.6  Programmable Channel Summer and Digital Mixer
          7. 6.3.7.1.7  Configurable Digital Decimation Filters
            1. 6.3.7.1.7.1 Linear-phase filters
              1. 6.3.7.1.7.1.1 Sampling Rate: 8kHz or 7.35kHz
              2. 6.3.7.1.7.1.2 Sampling Rate: 16kHz or 14.7kHz
              3. 6.3.7.1.7.1.3 Sampling Rate: 24kHz or 22.05kHz
              4. 6.3.7.1.7.1.4 Sampling Rate: 32kHz or 29.4kHz
              5. 6.3.7.1.7.1.5 Sampling Rate: 48kHz or 44.1kHz
              6. 6.3.7.1.7.1.6 Sampling Rate: 96kHz or 88.2kHz
              7. 6.3.7.1.7.1.7 Sampling Rate: 192kHz or 176.4kHz
            2. 6.3.7.1.7.2 Low-latency Filters
              1. 6.3.7.1.7.2.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.7.1.7.2.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.7.1.7.2.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.7.1.7.2.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.7.1.7.2.5 Sampling Rate: 192kHz or 176.4kHz
            3. 6.3.7.1.7.3 Ultra-Low-Latency Filters
              1. 6.3.7.1.7.3.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.7.1.7.3.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.7.1.7.3.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.7.1.7.3.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.7.1.7.3.5 Sampling Rate: 192kHz or 176.4kHz
          8. 6.3.7.1.8  Automatic Gain Controller (AGC)
          9. 6.3.7.1.9  Voice Activity Detection (VAD)
          10. 6.3.7.1.10 Ultrasonic Activity Detection (UAD)
        2. 6.3.7.2 DAC Signal-Chain
          1. 6.3.7.2.1 Programmable Channel Gain and Digital Volume Control
          2. 6.3.7.2.2 Programmable Channel Gain Calibration
          3. 6.3.7.2.3 Programmable Digital High-Pass Filter
          4. 6.3.7.2.4 Programmable Digital Biquad Filters
          5. 6.3.7.2.5 Configurable Digital Interpolation Filters
            1. 6.3.7.2.5.1 Linear-phase filters
              1. 6.3.7.2.5.1.1 Sampling Rate: 8kHz or 7.35kHz
              2. 6.3.7.2.5.1.2 Sampling Rate: 16kHz or 14.7kHz
              3. 6.3.7.2.5.1.3 Sampling Rate: 24kHz or 22.05kHz
              4. 6.3.7.2.5.1.4 Sampling Rate: 32kHz or 29.4kHz
              5. 6.3.7.2.5.1.5 Sampling Rate: 48kHz or 44.1kHz
              6. 6.3.7.2.5.1.6 Sampling Rate: 96kHz or 88.2kHz
              7. 6.3.7.2.5.1.7 Sampling Rate: 192kHz or 176.4kHz
            2. 6.3.7.2.5.2 Low-latency Filters
              1. 6.3.7.2.5.2.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.7.2.5.2.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.7.2.5.2.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.7.2.5.2.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.7.2.5.2.5 Sampling Rate: 192kHz or 176.4kHz
            3. 6.3.7.2.5.3 Ultra-Low-Latency Filters
              1. 6.3.7.2.5.3.1 Sampling Rate: 24kHz or 22.05kHz
              2. 6.3.7.2.5.3.2 Sampling Rate: 32kHz or 29.4kHz
              3. 6.3.7.2.5.3.3 Sampling Rate: 48kHz or 44.1kHz
              4. 6.3.7.2.5.3.4 Sampling Rate: 96kHz or 88.2kHz
              5. 6.3.7.2.5.3.5 Sampling Rate 192kHz or 176.4kHz
      8. 6.3.8 Interrupts, Status, and Digital I/O Pin Multiplexing
      9. 6.3.9 Power Tune Mode
    4. 6.4 Device Functional Modes
      1. 6.4.1 Sleep Mode or Software Shutdown
      2. 6.4.2 Software Reset
      3. 6.4.3 Active Mode
    5. 6.5 Programming
      1. 6.5.1 Control Serial Interfaces
        1. 6.5.1.1 General I2C Operation
        2. 6.5.1.2 I2C Single-Byte and Multiple-Byte Transfers
          1. 6.5.1.2.1 I2C Single-Byte Write
          2. 6.5.1.2.2 I2C Multiple-Byte Write
          3. 6.5.1.2.3 I2C Single-Byte Read
          4. 6.5.1.2.4 I2C Multiple-Byte Read
  8. 7 Register Maps
    1. 7.1 Device Configuration Registers
      1. 7.1.1 TAC5301-Q1_B0_P0 Registers
      2. 7.1.2 TAC5301-Q1_B0_P1 Registers
      3. 7.1.3 TAC5301-Q1_B0_P3 Registers
    2. 7.2 Programmable Coefficient Registers
      1. 7.2.1  Programmable Coefficient Registers: Page 8
      2. 7.2.2  Programmable Coefficient Registers: Page 9
      3. 7.2.3  Programmable Coefficient Registers: Page 10
      4. 7.2.4  Programmable Coefficient Registers: Page 11
      5. 7.2.5  Programmable Coefficient Registers: Page 15
      6. 7.2.6  Programmable Coefficient Registers: Page 16
      7. 7.2.7  Programmable Coefficient Registers: Page 17
      8. 7.2.8  Programmable Coefficient Registers: Page 18
      9. 7.2.9  Programmable Coefficient Registers: Page 19
      10. 7.2.10 Programmable Coefficient Registers: Page 25
      11. 7.2.11 Programmable Coefficient Registers: Page 26
      12. 7.2.12 Programmable Coefficient Registers: Page 27
      13. 7.2.13 Programmable Coefficient Registers: Page 28
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Typical Characteristics
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 IOVDD_IO_MODE for 1.8V and 1.2V Operation
    4. 8.4 Layout
      1. 8.4.1 Layout Example
      2. 8.4.2 Layout Guidelines
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Electrostatic Discharge Caution
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.2 Layout Guidelines

Each system design and printed circuit board (PCB) layout is unique. The layout must be carefully reviewed in the context of a specific PCB design. However, the following guidelines can optimize the device performance:

  • Connect the thermal pad to ground. Use a via pattern to connect the device thermal pad, which is the area directly under the device, to the ground planes. This connection helps dissipate heat from the device.
  • Star connect all ground pins to the board ground plane. Use the same ground between VSS and AVSS to avoid any potential voltage difference between them.
  • The supply decoupling capacitors used must be of a ceramic type with low ESR.
  • Route the analog differential audio signals differentially on the PCB for better noise immunity. Avoid crossing digital and analog signals to prevent undesirable crosstalk.
  • Avoid running high-frequency clock and control signals near INxx and OUTxx pins where possible.
  • The device internal voltage references must be filtered using external capacitors. Place the filter capacitors near the VREF pin for good performance.
  • Directly tap the MICBIAS pin to avoid common impedance when routing the biasing or supply traces for multiple microphones to avoid coupling across microphones.
  • Provide a direct connection from the VREF and MICBIAS external capacitor ground terminal to VSS.
  • Place the MICBIAS capacitor (with low equivalent series resistance) close to the device with minimal trace impedance.
  • Use MICBIAS and HVDD capacitors with a high voltage rating (> 25V) to support higher voltage MICBIAS operation.
  • An external circuit must be used to suppress or filter the amount of high-frequency electromagnetic interference (EMI) noise found in the microphone input path resulting from long cables (if used) in the system.
  • Use ground planes to provide the lowest impedance for power and signal current between the device and the decoupling capacitors. Treat the area directly under the device as a central ground area for the device, and all device grounds must be connected directly to that area.