SLASE86E June   2016  – December 2017 TAS2560

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  I2C Timing Requirements
    7. 7.7  I2S/LJF/RJF Timing in Master Mode
    8. 7.8  I2S/LJF/RJF Timing in Slave Mode
    9. 7.9  DSP Timing in Master Mode
    10. 7.10 DSP Timing in Slave Mode
    11. 7.11 PDM Timing
    12. 7.12 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  General I2C Operation
      2. 9.3.2  Single-Byte and Multiple-Byte Transfers
      3. 9.3.3  Single-Byte Write
      4. 9.3.4  Multiple-Byte Write and Incremental Multiple-Byte Write
      5. 9.3.5  Single-Byte Read
      6. 9.3.6  Multiple-Byte Read
      7. 9.3.7  PLL
      8. 9.3.8  Clock Distribution
      9. 9.3.9  Clock Error Detection
      10. 9.3.10 Class-D Edge Rate Control
      11. 9.3.11 IV Sense
      12. 9.3.12 Boost Control
      13. 9.3.13 Thermal Fold-back
      14. 9.3.14 Battery Guard AGC
      15. 9.3.15 Configurable Boost Current Limit (ILIM)
      16. 9.3.16 Fault Protection
        1. 9.3.16.1 Speaker Over-Current
        2. 9.3.16.2 Analog Under-Voltage
        3. 9.3.16.3 Die Over-Temperature
        4. 9.3.16.4 Clocking Faults
        5. 9.3.16.5 Brownout
      17. 9.3.17 Spread Spectrum vs Synchronized
      18. 9.3.18 IRQs and Flags
      19. 9.3.19 CRC checksum for I2C
      20. 9.3.20 PurePath Console 3 Software TAS2560 Application
    4. 9.4 Device Functional Modes
      1. 9.4.1 Audio Digital I/O Interface
        1. 9.4.1.1 I2S Mode
        2. 9.4.1.2 DSP Mode
        3. 9.4.1.3 DSP Time Slot Mode
        4. 9.4.1.4 Right-Justified Mode (RJF)
        5. 9.4.1.5 Left-Justified Mode (LJF)
        6. 9.4.1.6 Mono PCM Mode
        7. 9.4.1.7 Stereo Application Example - TDM Mode
      2. 9.4.2 PDM MODE
    5. 9.5 Operational Modes
      1. 9.5.1 Hardware Shutdown
      2. 9.5.2 Software Shutdown
      3. 9.5.3 Low Power Sleep
      4. 9.5.4 Software Reset
      5. 9.5.5 Device Processing Modes
        1. 9.5.5.1 Mode 1 - PCM input playback only
        2. 9.5.5.2 Mode 2 - PCM input playback + PCM IVsense output
        3. 9.5.5.3 Mode 2 96k
        4. 9.5.5.4 Mode 3 - PCM input playback + PDM IVsense output
        5. 9.5.5.5 Mode 4 - PDM input playback only
        6. 9.5.5.6 Mode 5 - PDM input playback + PDM IVsense output
    6. 9.6 Programming
      1. 9.6.1 Device Power Up and Un-mute Sequence 8Ω load
      2. 9.6.2 Device Power Up and Un-mute Sequence 4Ω or 6Ω load
      3. 9.6.3 Mute and Device Power Down Sequence
    7. 9.7 Register Map
      1. 9.7.1  Register Map Summary
        1. 9.7.1.1 Register Summary Table
      2. 9.7.2  PAGE (book=0x00 page=0x00 address=0x00) [reset=0h]
      3. 9.7.3  RESET (book=0x00 page=0x00 address=0x01) [reset=0h]
      4. 9.7.4  MODE (book=0x00 page=0x00 address=0x02) [reset=1h]
      5. 9.7.5  SPK_CTRL (book=0x00 page=0x00 address=0x04) [reset=5Fh]
      6. 9.7.6  PWR_CTRL_2 (book=0x00 page=0x00 address=0x05) [reset=0h]
      7. 9.7.7  PWR_CTRL_1 (book=0x00 page=0x00 address=0x07) [reset=0h]
      8. 9.7.8  RAMP_CTRL (book=0x00 page=0x00 address=0x08) [reset=1h]
      9. 9.7.9  EDGE_ISNS_BOOST (book=0x00 page=0x00 address=0x09) [reset=83h]
      10. 9.7.10 PLL_CLKIN (book=0x00 page=0x00 address=0x0F) [reset=41h]
      11. 9.7.11 PLL_JVAL (book=0x00 page=0x00 address=0x10) [reset=4h]
      12. 9.7.12 PLL_DVAL_1 (book=0x00 page=0x00 address=0x11) [reset=0h]
      13. 9.7.13 PLL_DVAL_2 (book=0x00 page=0x00 address=0x12) [reset=0h]
      14. 9.7.14 ASI_FORMAT (book=0x00 page=0x00 address=0x14) [reset=2h]
      15. 9.7.15 ASI_CHANNEL (book=0x00 page=0x00 address=0x15) [reset=0h]
      16. 9.7.16 ASI_OFFSET_1 (book=0x00 page=0x00 address=0x16) [reset=0h]
      17. 9.7.17 ASI_OFFSET_2 (book=0x00 page=0x00 address=0x17) [reset=0h]
      18. 9.7.18 ASI_CFG_1 (book=0x00 page=0x00 address=0x18) [reset=0h]
      19. 9.7.19 ASI_DIV_SRC (book=0x00 page=0x00 address=0x19) [reset=0h]
      20. 9.7.20 ASI_BDIV (book=0x00 page=0x00 address=0x1A) [reset=1h]
      21. 9.7.21 ASI_WDIV (book=0x00 page=0x00 address=0x1B) [reset=40h]
      22. 9.7.22 PDM_CFG (book=0x00 page=0x00 address=0x1C) [reset=0h]
      23. 9.7.23 PDM_DIV (book=0x00 page=0x00 address=0x1D) [reset=8h]
      24. 9.7.24 DSD_DIV (book=0x00 page=0x00 address=0x1E) [reset=8h]
      25. 9.7.25 CLK_ERR_1 (book=0x00 page=0x00 address=0x21) [reset=3h]
      26. 9.7.26 CLK_ERR_2 (book=0x00 page=0x00 address=0x22) [reset=3Fh]
      27. 9.7.27 IRQ_PIN_CFG (book=0x00 page=0x00 address=0x23) [reset=21h]
      28. 9.7.28 INT_CFG_1 (book=0x00 page=0x00 address=0x24) [reset=0h]
      29. 9.7.29 INT_CFG_2 (book=0x00 page=0x00 address=0x25) [reset=0h]
      30. 9.7.30 INT_DET_1 (book=0x00 page=0x00 address=0x26) [reset=0h]
      31. 9.7.31 INT_DET_2 (book=0x00 page=0x00 address=0x27) [reset=0h]
      32. 9.7.32 STATUS_POWER (book=0x00 page=0x00 address=0x2A) [reset=0h]
      33. 9.7.33 SAR_VBAT_MSB (book=0x00 page=0x00 address=0x2D) [reset=C0h]
      34. 9.7.34 SAR_VBAT_LSB (book=0x00 page=0x00 address=0x2E) [reset=0h]
      35. 9.7.35 DIE_TEMP_SENSOR (book=0x00 page=0x00 address=0x31) [reset=0h]
      36. 9.7.36 LOW_PWR_MODE (book=0x00 page=0x00 address=0x35) [reset=0h]
      37. 9.7.37 PCM_RATE (book=0x00 page=0x00 address=0x36) [reset=32h]
      38. 9.7.38 CLOCK_ERR_CFG_1 (book=0x00 page=0x00 address=0x4F) [reset=0h]
      39. 9.7.39 CLOCK_ERR_CFG_2 (book=0x00 page=0x00 address=0x50) [reset=11h]
      40. 9.7.40 PROTECTION_CFG_1 (book=0x00 page=0x00 address=0x58) [reset=3h]
      41. 9.7.41 CRC_CHECKSUM (book=0x00 page=0x00 address=0x7E) [reset=0h]
      42. 9.7.42 BOOK (book=0x00 page=0x00 address=0x7F) [reset=0h]
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Design Requirements
        1. 10.2.1.1 Detailed Design Procedure
          1. 10.2.1.1.1 Mono/Stereo Configuration
          2. 10.2.1.1.2 Boost Converter Passive Devices
          3. 10.2.1.1.3 EMI Passive Devices
          4. 10.2.1.1.4 Miscellaneous Passive Devices
      2. 10.2.2 Application Performance Plots
    3. 10.3 Initialization Set Up
  11. 11Power Supply Recommendations
    1. 11.1 Power Supplies
    2. 11.2 Power Supply Sequencing
      1. 11.2.1 Boost Supply Details
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Dimensions

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YFF|30
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Layout

12.1 Layout Guidelines

  • Place the boost inductor between VBAT and SW close to device terminals with no VIAS between the device terminals and the inductor.
  • Place the capacitor between VBOOST close to device terminals with no VIAS between the device terminals and capacitor.
  • Place the capacitor between VBOOST/VBAT and GND close to device terminals with no VIAS between the device terminals and capacitor.
  • Do not use VIAS for traces that carry high current. These include the traces for VBOOST, SW, VBAT, PGND and the speaker SPK_P, SPK_M.
  • Use epoxy filled vias for the interior pads.
  • Connect VSENSE_P, VSENSE_N as close as possible to the speaker.
    • VSENSE_P, VSENSE_N should be connected between the EMI ferrite and the speaker if EMI ferrites are used on SPK_P, SPK_M.
    • EMI ferrites must be used if EMI capacitors are used on SPK_P, SPK_M.
  • Use a ground plane with multiple vias for each terminal to create a low-impedance connection to GND for minimum ground noise.
  • Use supply decoupling capacitors as shown in Figure 98 and described in Power Supplies.
  • Place EMI ferrites, if used, close to the device.

12.2 Layout Example

TAS2560 TAS2560_Layout.gif Figure 101. TAS2560 Board Layout