SCPS270B August   2020  – November 2023 TCA4307

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Hot bus insertion
      2. 7.3.2 Pre-charge voltage
      3. 7.3.3 Rise time accelerators
      4. 7.3.4 Bus ready output indicator
      5. 7.3.5 Powered-off high impedance for I2C and I/O pins
      6. 7.3.6 Supports clock stretching and arbitration
      7. 7.3.7 Stuck bus recovery
    4. 7.4 Device Functional Modes
      1. 7.4.1 Start-up and precharge
      2. 7.4.2 Bus idle
      3. 7.4.3 Bus active
      4. 7.4.4 Bus stuck
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Series connections
        2. 8.2.1.2 Multiple connections to a common node
        3. 8.2.1.3 Propagation delays
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
      4. 8.2.4 Typical Application on a Backplane
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Best Practices
      2. 8.3.2 Power-on Reset Requirements
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision A (October 2023) to Revision B (November 2023)

  • Deleted the Product Preview note from the DGR package in the Package Information tableGo

Changes from Revision * (August 2020) to Revision A (October 2023)

  • Changed all instances of legacy terminology to controller and target where I2C is mentionedGo
  • Added the DRG package to the Package Information tableGo
  • Added DRG to the Thermal Information tableGo