SBOS875B August   2017  – July 2018 THS3491

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Typical Arbitrary Waveform Generator Output Drive Circuit
      2.      Harmonic Distortion vs Frequency
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: VS = ±15 V
    6. 7.6 Electrical Characteristics: VS = ±7.5 V
    7. 7.7 Typical Characteristics: ±15 V
    8. 7.8 Typical Characteristics: ±7.5 V
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-Down (PD) Pin
      2. 8.3.2 Power-Down Reference (REF) Pin
      3. 8.3.3 Internal Junction Temperature Sense (TJ_SENSE) Pin
    4. 8.4 Device Functional Modes
      1. 8.4.1 Wideband Noninverting Operation
      2. 8.4.2 Wideband, Inverting Operation
      3. 8.4.3 Single-Supply Operation
      4. 8.4.4 Maximum Recommended Output Voltage
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Driving Capacitive Loads
      2. 9.1.2 Video Distribution
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PowerPAD™ Integrated Circuit Package Design Considerations (DDA Package Only)
        1. 11.1.1.1 PowerPAD™ Integrated Circuit Package Layout Considerations
        2. 11.1.1.2 Power Dissipation and Thermal Considerations
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Pin Configuration and Functions

DDA Package
8-Pin HSOIC With PowerPAD™
Top View
THS3491 ths3491-dda-pin-configuration.gif
NC - no internal connection
RGT Package
16-Pin VQFN With Exposed Thermal Pad
Top View
THS3491 ths3491-rgt-pin-configuration.gif
NC - no internal connection

Pin Functions

PIN (1) TYPE (2) DESCRIPTION
NAME HSOIC VQFN
FB 1 O Input side feedback pin
GND 5 GND Ground, PD logic reference on the VQFN-16 (RGT) package
NC 5 2, 9, 12, 15 No connect (there is no internal connection). Recommended connection to a heat spreading plane, typically GND.
PD 8 16 I Amplifier power down: low = amplifier disabled, high (default) = amplifier enabled
REF 1 I PD logic reference on the SOIC-8 (DDA) package. Typically connected to GND.
TJ_SENSE 6 O Voltage proportional to die temperature
VIN– 2 3 I Inverting input
VIN+ 3 4 I Noninverting input
VOUT 6 10, 11 O Amplifier output
–VS 4 7, 8 P Negative power supply
+VS 7 13, 14 P Positive power supply
Thermal pad Thermal pad. Electrically isolated from the device. Recommended connection to a heat spreading plane, typically GND.
Both packages include a backside thermal pad. The thermal pad can be connected to a heat spreading plane that can be at any voltage because the device die is electrically isolated from this metal plate. The thermal pad can also be unused (not connected to any heat spreading plane or voltage) giving higher thermal impedance.
GND = ground, I = input, O = output, P = power