SLLSFQ4A September   2022  – March 2023 THVD1424

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings [IEC]
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Power Dissipation
    7. 6.7  Electrical Characteristics
    8. 6.8  Switching Characteristics_500 kbps
    9. 6.9  Switching Characteristics_20 Mbps
    10. 6.10 Switching Characteristics_Termination resistor
    11. 6.11 Switching Characteristics_Duplex switching
    12. 6.12 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 On-Chip Switchable Termination
      2. 8.4.2 Operational Data rate
      3. 8.4.3 Protection Features
  9. 9 Application Information Disclaimer
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Data Rate and Bus Length
        2. 9.2.1.2 Stub Length
        3. 9.2.1.3 Bus Loading
        4. 9.2.1.4 Receiver Failsafe
        5. 9.2.1.5 Transient Protection
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.12 Typical Characteristics

GUID-20220915-SS0I-PSLG-XPQS-M2HJHBTGZPGG-low.svg
DE = VIO TA = 25°C
Figure 6-1 Driver Output voltage vs Driver Output Current
GUID-20220915-SS0I-ZGP6-FBRB-W78J5LMZVKGZ-low.svg
RL = 54 Ω DE = VIO D = VIO
TA = 25°C
Figure 6-3 Supply Current vs Supply Voltage
GUID-20220915-SS0I-PKJL-25G5-6XRVRTDSHKKX-low.svg
RL = 54 Ω CL = 50 pF DE = VIO
Figure 6-5 Driver Rise or Fall Time vs Temperature (500 kbps)
GUID-20220915-SS0I-D5MK-C4JV-QDMSH9SGRCBM-low.svg
RL = 54 Ω CL = 50 pF DE = VIO
Figure 6-7 Driver Rise or Fall Time vs Temperature (20 Mbps)
GUID-20220915-SS0I-GMJD-DZKG-0LJ3HPK4JFFW-low.svg
RL = 54 Ω TA = 25 °C
DE = VIO
Figure 6-9 Supply Current vs Signal Rate (20 Mbps)
GUID-20220915-SS0I-4TRD-RFZ7-VVKS64QTBGPG-low.svg
DE = VIO TA = 25°C
Figure 6-2 Driver Differential Output voltage vs Driver Output Current
GUID-20220915-SS0I-CPNV-TPM4-TZB0VSCTF9P7-low.svg
RL = 54 Ω DE = VIO D = VIO
Figure 6-4 Driver Output Voltage vs Temperature
GUID-20220915-SS0I-9NQF-6JNJ-QF7KD4T5QMPK-low.svg
RL = 54 Ω CL = 50 pF DE = VIO
Figure 6-6 Driver Propagation Delay vs Temperature (500 kbps)
GUID-20220915-SS0I-QJ1D-3XXJ-RJ6PXPKJHVN8-low.svg
RL = 54 Ω CL = 50 pF DE = VIO
Figure 6-8 Driver Propagation Delay vs Temperature (20 Mbps)