SLLSFP5 January   2024 THVD2419 , THVD2429

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings [IEC]
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Power Dissipation
    7. 6.7 Electrical Characteristics
    8. 6.8 Switching Characteristics_250kbps
    9. 6.9 Switching Characteristics_20Mbps
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Electrostatic Discharge (ESD) Protection
      2. 8.3.2 Electrical Fast Transient (EFT) Protection
      3. 8.3.3 Surge Protection
      4. 8.3.4 Enhanced Receiver Noise Immunity
      5. 8.3.5 Failsafe Receiver
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Data Rate and Bus Length
        2. 9.2.1.2 Stub Length
        3. 9.2.1.3 Bus Loading
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DRC|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

THVD24x9 devices are half-duplex RS-485 transceivers with integrated surge protection. Surge protection is achieved by integrating transient voltage suppressor (TVS) diodes in the standard 8-pin SOIC (D) package as well as small 10-pin VSON package. This feature increases the reliability by providing better immunity to noise transients coupled to the data cable which eliminates the need for external protection components.

THVD24x9 devices in the standard pin-out SOIC package operate from a single
3.3V or 5V supply. In addition, THVD24x9 devices in 10-pin VSON package and the V-versions of SOIC package support an additional VIO supply to operate the IOs from as low as 1.65V supply level. The devices in this family feature a wide common-mode voltage range making them suitable for multi-point applications over long cable runs.

Package Information
PART NUMBERPACKAGE(1)PACKAGE SIZE(2)
THVD2419, '2429
THVD2419V, '2429V		SOIC (8)4.9mm × 6mm
THVD2419, '2429VSON (10)3mm × 3mm
(1) For more information, see Section 12.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
GUID-D809F01F-FC8A-4D3C-B385-221A129BD251-low.gifTHVD24x9 Block Diagram (SOIC Package)
GUID-20220124-SS0I-TVTD-1QFM-PSKDNLSTNH43-low.svgTHVD24x9 Block Diagram (VSON Package)