SLLSFO2B December   2022  – March 2024 THVD2410V , THVD2412V , THVD2450V , THVD2452V

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings [IEC]
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Power Dissipation
    7. 5.7  Electrical Characteristics
    8. 5.8  Switching Characteristics_250 kbps
    9. 5.9  Switching Characteristics_1 Mbps
    10. 5.10 Switching Characteristics_20 Mbps
    11. 5.11 Switching Characteristics_50 Mbps
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 ±70 V Fault Protection
      2. 7.3.2 Integrated IEC ESD and EFT Protection
      3. 7.3.3 Driver Overvoltage and Overcurrent Protection
      4. 7.3.4 Enhanced Receiver Noise Immunity
      5. 7.3.5 Receiver Fail-Safe Operation
      6. 7.3.6 Low-Power Shutdown Mode
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Data Rate and Bus Length
        2. 8.2.1.2 Stub Length
        3. 8.2.1.3 Bus Loading
        4. 8.2.1.4 Transient Protection
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Meets or exceeds the requirements of the TIA/EIA-485A and TIA/EIA-422B standards
  • 3V to 5.5V RS-485 supply voltage
  • Differential output exceeds 2.1V for PROFIBUS
    compatibility with 5V supply
  • 1.65V to 5.5V Supply for logic signal interface
  • SLR Pin Selectable Data Rates:
    • THVD2410V, THVD2412V: 250kbps and 1Mbps
    • THVD2450V, THVD2452V: 20Mbps and 50Mbps
  • Bus I/O protection
    • ±70V DC bus fault
    • ±16kV HBM ESD
    • Half duplex devices: ±15kV IEC 61000-4-2 contact and air-gap discharge
    • Full duplex devices: ±8kV IEC 61000-4-2 contact and air-gap discharge
    • ±4kV IEC 61000-4-4 fast transient burst
  • Half-duplex and Full-Duplex devices available in two speed grades
  • Extended ambient temperature range: -40°C to 125°C
  • Extended operational common-mode range: ±25V
  • Enhanced receiver hysteresis for noise immunity
  • Low power consumption
    • Low shutdown supply current: < 5µA
    • Quiescent current during operation: < 5.3mA
  • Glitch-free power-up/down for hot plug-in capability
  • Open, short, and idle bus failsafe
  • Thermal shutdown
  • 1/8 unit load (up to 256 bus nodes) in -7V to 12V common mode range
  • Small 3mm x 3mm VSON package to save board space, or 14-SOIC for drop-in compatibility