SLLSFO2B December   2022  – March 2024 THVD2410V , THVD2412V , THVD2450V , THVD2452V

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Ratings [IEC]
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Power Dissipation
    7. 5.7  Electrical Characteristics
    8. 5.8  Switching Characteristics_250 kbps
    9. 5.9  Switching Characteristics_1 Mbps
    10. 5.10 Switching Characteristics_20 Mbps
    11. 5.11 Switching Characteristics_50 Mbps
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 ±70 V Fault Protection
      2. 7.3.2 Integrated IEC ESD and EFT Protection
      3. 7.3.3 Driver Overvoltage and Overcurrent Protection
      4. 7.3.4 Enhanced Receiver Noise Immunity
      5. 7.3.5 Receiver Fail-Safe Operation
      6. 7.3.6 Low-Power Shutdown Mode
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Data Rate and Bus Length
        2. 8.2.1.2 Stub Length
        3. 8.2.1.3 Bus Loading
        4. 8.2.1.4 Transient Protection
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Power Dissipation

PARAMETER TEST CONDITIONS VALUE UNIT
PD Driver and receiver enabled, loopback for full duplex devices (A connected to Y, B connected to Z)
VCC = 5.5 V, TA = 125 °C,
square wave at 50% duty cycle		 Unterminated
RL = 300 Ω, CL = 50 pF (driver)		 THVD2410V, THVD2412V 250 kbps 160 mW
THVD2410V, THVD2412V 1Mbps 250
THVD2450V, THVD2452V 20Mbps 310
THVD2450V, THVD2452V 50 Mbps 630
RS-422 load
RL = 100 Ω, CL = 50 pF (driver)		 THVD2410V, THVD2412V 250 kbps 170 mW
THVD2410V, THVD2412V 1Mbps 250
THVD2450V, THVD2452V 20Mbps 290
THVD2450V, THVD2452V 50 Mbps 570
RS-485 load
RL = 54 Ω, CL = 50 pF (driver)		 THVD2410V, THVD2412V 250 kbps 220 mW
THVD2410V, THVD2412V 1Mbps 280
THVD2450V, THVD2452V 20Mbps 325
THVD2450V, THVD2452V 50 Mbps 560