SLOS154C December   1995  – July 2025 TLC27L1 , TLC27L1A

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Dissipation Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Electrical Characteristics, C Suffix
    5. 5.5  Operating Characteristics, VDD = 5V, C Suffix
    6. 5.6  Operating Characteristics, VDD = 10V, C Suffix
    7. 5.7  Electrical Characteristics, I Suffix
    8. 5.8  Operating Characteristics, VDD = 5V, I Suffix
    9. 5.9  Operating Characteristics, VDD = 10V, I Suffix
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Single-Supply Versus Split-Supply Test Circuits
    2. 6.2 Input Bias Current
    3. 6.3 Low-Level Output Voltage
    4. 6.4 Input Offset Voltage Temperature Coefficient
    5. 6.5 Full-Power Response
    6. 6.6 Test Time
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Single-Supply Operation
      2. 7.1.2 Input Characteristics
      3. 7.1.3 Noise Performance
      4. 7.1.4 Feedback
      5. 7.1.5 Electrostatic Discharge Protection
      6. 7.1.6 Latch-Up
      7. 7.1.7 Output Characteristics
      8. 7.1.8 Typical Applications
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Input Offset Voltage Temperature Coefficient

Erroneous readings often result from attempts to measure the temperature coefficient of input offset voltage. This parameter is actually a calculation using input offset voltage measurements obtained at two different temperatures. When one (or both) of the temperatures is less than freezing, moisture is able to collect on both the device and the test socket. This moisture results in leakage and contact resistance that potentially causes erroneous input offset voltage readings. The isolation techniques previously mentioned have no effect on the leakage because the moisture also covers the isolation metal, thereby rendering the techniques useless. Perform these measurements at temperatures greater than freezing to minimize error.