SLVSJD7 February   1997  – July 2025 TLE2021 , TLE2021A , TLE2021M , TLE2022 , TLE2022A , TLE2022AM , TLE2022M , TLE2024 , TLE2024A , TLE2024B , TLE2024BM

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Tables
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Recommended Operating Conditions
    3. 6.3  Thermal Information for TLE2021
    4. 6.4  Thermal Information for TLE2022
    5. 6.5  Thermal Information for TLE2024
    6. 6.6  Electrical Characteristics for TLE2021, VCC = ±15V
    7. 6.7  Electrical Characteristics for TLE2021, VCC = 5V
    8. 6.8  Electrical Characteristics for TLE2022, VCC = ±15V
    9. 6.9  Electrical Characteristics for TLE2022, VCC = 5V
    10. 6.10 Electrical Characteristics for TLE2024, VCC = ±15V
    11. 6.11 Electrical Characteristics for TLE2024, VCC = 5V
    12. 6.12 Typical Characteristics
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Voltage-Follower Applications
      2. 7.1.2 Input Offset Voltage Null
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • P|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Thermal Information for TLE2024

THERMAL METRIC(1) TLE2024 UNIT
DW (SOIC) N (PDIP)
16 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 62.7 53.9 ℃/W
RθJC(top) Junction-to-case(top) thermal resistance 28.0 30.7 ℃/W
RθJB Junction-to-board thermal resistance 31.6 25.2 ℃/W
ψJT Junction-to-top characterization parameter 4.3 9.0 ℃/W
ψJB Junction-to-board characterization parameter 31.0 24.7 ℃/W
RθJC(bot) Junction-to-case(bottom) thermal resistance N/A N/A ℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.