SLAS509F December   2006  – December 2014 TLV320AIC3106

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Simplified Diagram
  5. Revision History
  6. Description (continued)
  7. Device Comparison Table
  8. Pin Configuration and Functions
  9. Specifications
    1. 9.1 Absolute Maximum Ratings
    2. 9.2 ESD Ratings
    3. 9.3 Recommended Operating Conditions
    4. 9.4 Thermal Information
    5. 9.5 Electrical Characteristics
    6. 9.6 Timing Requirements: Audio Data Serial Interface
    7. 9.7 Typical Characteristics
  10. 10Parameter Measurement Information
  11. 11Detailed Description
    1. 11.1 Overview
    2. 11.2 Functional Block Diagram
    3. 11.3 Feature Description
      1. 11.3.1  Hardware Reset
      2. 11.3.2  Digital Audio Data Serial Interface
        1. 11.3.2.1 Right-Justified Mode
        2. 11.3.2.2 Left-Justified Mode
        3. 11.3.2.3 I2S Mode
        4. 11.3.2.4 DSP Mode
        5. 11.3.2.5 TDM Data Transfer
      3. 11.3.3  Audio Data Converters
        1. 11.3.3.1 Audio Clock Generation
        2. 11.3.3.2 Stereo Audio ADC
          1. 11.3.3.2.1 Stereo Audio ADC High-Pass Filter
          2. 11.3.3.2.2 Automatic Gain Control (AGC)
            1. 11.3.3.2.2.1 Target Level
            2. 11.3.3.2.2.2 Attack Time
            3. 11.3.3.2.2.3 Decay Time
            4. 11.3.3.2.2.4 Noise Gate Threshold
            5. 11.3.3.2.2.5 Maximum PGA Gain Applicable
        3. 11.3.3.3 Stereo Audio DAC
          1. 11.3.3.3.1 Digital Audio Processing for Playback
          2. 11.3.3.3.2 Digital Interpolation Filter
          3. 11.3.3.3.3 Delta-Sigma Audio DAC
          4. 11.3.3.3.4 Audio DAC Digital Volume Control
          5. 11.3.3.3.5 Increasing DAC Dynamic Range
          6. 11.3.3.3.6 Analog Output Common-Mode Adjustment
          7. 11.3.3.3.7 Audio DAC Power Control
      4. 11.3.4  Audio Analog Inputs
      5. 11.3.5  Analog Fully Differential Line Output Drivers
      6. 11.3.6  Analog High Power Output Drivers
      7. 11.3.7  Input Impedance and VCM Control
      8. 11.3.8  General-Purpose I/O
      9. 11.3.9  Digital Microphone Connectivity
      10. 11.3.10 Micbias Generation
      11. 11.3.11 Short Circuit Output Protection
      12. 11.3.12 Jack/Headset Detection
    4. 11.4 Device Functional Modes
      1. 11.4.1 Bypass Path Mode
        1. 11.4.1.1 Analog Input Bypass Path Functionality
        2. 11.4.1.2 ADC PGA Signal Bypass Path Functionality
        3. 11.4.1.3 Passive Analog Bypass During Powerdown
      2. 11.4.2 Digital Audio Processing for Record Path
    5. 11.5 Programming
      1. 11.5.1 Digital Control Serial Interface
        1. 11.5.1.1 SPI Control Mode
          1. 11.5.1.1.1 SPI Communication Protocol
          2. 11.5.1.1.2 Limitation on Register Writing
          3. 11.5.1.1.3 Continuous Read / Write Operation
        2. 11.5.1.2 I2C Control Interface
          1. 11.5.1.2.1 I2C BUS Debug in a Glitched System
    6. 11.6 Register Maps
    7. 11.7 Output Stage Volume Controls
  12. 12Application and Implementation
    1. 12.1 Application Information
    2. 12.2 Typical Application
      1. 12.2.1 Design Requirements
      2. 12.2.2 Detailed Design Procedure
      3. 12.2.3 Application Curves
  13. 13Power Supply Recommendations
  14. 14Layout
    1. 14.1 Layout Guidelines
    2. 14.2 Layout Example
  15. 15Device and Documentation Support
    1. 15.1 Trademarks
    2. 15.2 Electrostatic Discharge Caution
    3. 15.3 Glossary
  16. 16Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGZ|48
  • ZQE|80
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Stereo Audio DAC
    • 102-dBA Signal-to-Noise Ratio
    • 16/20/24/32-Bit Data
    • Supports Rates From 8 kHz to 96 kHz
    • 3D/Bass/Treble/EQ/De-Emphasis Effects
    • Flexible Power Saving Modes and Performance are Available
  • Stereo Audio ADC
    • 92-dBA Signal-to-Noise Ratio
    • Supports Rates From 8 kHz to 96 kHz
    • Digital Signal Processing and Noise Filtering Available During Record
  • Ten Audio Input Pins
    • Programmable in Single-Ended or Fully Differential Configurations
    • 3-State Capability for Floating Input Configurations
  • Seven Audio Output Drivers
    • Stereo Fully Differential or Single-Ended Headphone Drivers
    • Fully Differential Stereo Line Outputs
    • Fully Differential Mono Output
  • Low Power: 15-mW Stereo 48-kHz Playback With 3.3-V Analog Supply
  • Ultralow-Power Mode with Passive Analog Bypass
  • Programmable Input/Output Analog Gains
  • Automatic Gain Control (AGC) for Record
  • Programmable Microphone Bias Level
  • Programmable PLL for Flexible Clock Generation
  • Control Bus Selectable SPI or I2C
  • Audio Serial Data Bus Supports I2S, Left/Right-Justified, DSP, and TDM Modes
  • Alternate Serial PCM/I2S Data Bus for Easy Connection to Bluetooth™ Module
  • Concurrent Digital Microphone and Analog Microphone Support Available
  • Extensive Modular Power Control
  • Power Supplies:
    • Analog: 2.7 V–3.6 V.
    • Digital Core: 1.65 V–1.95 V
    • Digital I/O: 1.1 V–3.6 V
    Packages: 5.00 mm × 5.00 mm 80-pin VFBGA;
    7.00 mm × 7.00 mm 48-pin QFN

2 Applications

  • Digital Cameras
  • Smart Cellular Phones

3 Description

The TLV320AIC3106 is a low-power stereo audio codec with stereo headphone amplifier, as well as multiple inputs and outputs programmable in single-ended or fully differential configurations. Extensive register-based power control is included, enabling stereo 48-kHz DAC playback as low as 15 mW from a 3.3-V analog supply, making it ideal for portable battery-powered audio and telephony applications.

The record path of the TLV320AIC3106 contains integrated microphone bias, digitally controlled stereo microphone preamplifier, and automatic gain control (AGC), with mix/mux capability among the multiple analog inputs. Programmable filters are available during record which can remove audible noise that can occur during optical zooming in digital cameras.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TLV320AIC3106 BGA MICROSTAR JUNIOR (80) 5.00 mm x 5.00 mm
VQFN (48) 7.00 mm x 7.00 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

4 Simplified Diagram

TLV320AIC3106 SimplifiedDiagram_slas509.png