SBOSA23D May   2020  – September 2021 TLV9151-Q1 , TLV9152-Q1 , TLV9154-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information for Single Channel
    5. 6.5 Thermal Information for Dual Channel
    6. 6.6 Thermal Information for Quad Channel
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 EMI Rejection
      2. 7.3.2 Thermal Protection
      3. 7.3.3 Capacitive Load and Stability
      4. 7.3.4 Common-Mode Voltage Range
      5. 7.3.5 Phase Reversal Protection
      6. 7.3.6 Electrical Overstress
      7. 7.3.7 Overload Recovery
      8. 7.3.8 Typical Specifications and Distributions
      9. 7.3.9 Packages With an Exposed Thermal Pad
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Low-Side Current Measurement
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5.     Trademarks
    6. 11.5 Electrostatic Discharge Caution
    7. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from Revision C (May 2021) to Revision D (September 2021)

  • Deleted preview note from SOIC (14) package in Device Information tableGo
  • Deleted preview note from SOT-23 (14) package in Device Information tableGo
  • Deleted preview note from SOIC (8) package in Device Information tableGo
  • Deleted preview note from SOT-23 (5) package in Device Information tableGo
  • Deleted preview note from SOT-23 (14) package in Pin Configuration and Functions section.Go
  • Deleted preview note from SOIC (14) package in Pin Configuration and Functions section.Go
  • Deleted preview note from SOIC (8) package in Pin Configuration and Functions section.Go
  • Deleted preview note from SOT-23 (5) package in Pin Configuration and Functions section.Go

Changes from Revision B (March 2021) to Revision C (May 2021)

  • Deleted preview note from TSSOP (14) package in Device Information tableGo
  • Deleted preview note from TSSOP (14) package in Pin Configuration and Functions section.Go
  • Deleted preview note from PW package in Thermal Information for Quad Channel table. Go

Changes from Revision A (January 2021) to Revision B (March 2021)

  • Changed device status from Advance Information to Production Data Go
  • Deleted preview note from VSSOP (8) package in Device Information table.Go
  • Deleted preview note from VSSOP (8) package in Pin Configuration and Functions sectionGo