SLYS049A March   2025  – June 2025 TMAG5133

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Magnetic Characteristics
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 X1LGA Magnetic Flux Direction
      2. 7.3.2 X1LGA Unipolar Output
      3. 7.3.3 Sampling Rate
      4. 7.3.4 Hall Element Location
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Power supply voltage VCC –0.3 6 V
Pin voltage OUT1, OUT2 –0.3 VCC + 0.3V
Output pin current OUT1, OUT2 –5.5 5.5 mA
Magnetic flux density, B Unlimited T
Junction temperature, TJ –65 150 °C
Storage temperature, Tstg –65 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum
Ratings do not imply functional operation of the device at these or any other conditions beyond those listed
under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within
the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability,
functionality, performance, and shorten the device lifetime.