SLLSF57A August   2022  – April 2024 TMDS1204

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD and Latch-Up Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Feature Description
      1. 7.2.1  4-Level Inputs
      2. 7.2.2  I/O Voltage Level Selection
      3. 7.2.3  HPD_OUT
      4. 7.2.4  Lane Control
      5. 7.2.5  Swap
      6. 7.2.6  Linear and Limited Redriver
      7. 7.2.7  Main Link Inputs
      8. 7.2.8  Receiver Equalizer
      9. 7.2.9  CTLE Bypass
      10. 7.2.10 Adaptive Equalization in HDMI 2.1 FRL
        1. 7.2.10.1 HDMI 2.1 TX Compliance Testing with AEQ Enabled
      11. 7.2.11 HDMI 2.1 Link Training Compatible Rx EQ
      12. 7.2.12 Input Signal Detect
        1. 7.2.12.1 SIGDET_OUT Indicator
      13. 7.2.13 Main Link Outputs
        1. 7.2.13.1 Transmitter Bias
        2. 7.2.13.2 Transmitter Impedance Control
        3. 7.2.13.3 TX Slew Rate Control
        4. 7.2.13.4 TX Pre-Emphasis and De-Emphasis Control
        5. 7.2.13.5 TX Swing Control
        6. 7.2.13.6 Fan-out Buffer
      14. 7.2.14 HDMI DDC Capacitance
      15. 7.2.15 DisplayPort
    3. 7.3 Device Functional Modes
      1. 7.3.1 MODE Control
        1. 7.3.1.1 I2C Mode (MODE = "F")
        2. 7.3.1.2 Pin Strap Modes
          1. 7.3.1.2.1 Pin-Strap: HDMI 1.4 and HDMI 2.0 Functional Description
          2. 7.3.1.2.2 Pin-Strap HDMI 2.1 Function (MODE = "0"): Fixed Rx EQ)
          3. 7.3.1.2.3 Pin-Strap HDMI 2.1 Function (Mode = "1"): Flexible Rx EQ
          4. 7.3.1.2.4 Pin-Strap HDMI 2.1 Function (Mode = "R"): Flexible Rx EQ and Fan-Out Buffer
      2. 7.3.2 DDC Snoop Feature
        1. 7.3.2.1 HDMI Type
        2. 7.3.2.2 HDMI 2.1 FRL Snoop
      3. 7.3.3 Low Power States
    4. 7.4 Programming
      1. 7.4.1 Pseudocode Examples
        1. 7.4.1.1 HDMI 2.1 Source Example with DDC Snoop Disabled and DDC Buffer Disabled
        2. 7.4.1.2 Sink Example
      2. 7.4.2 TMDS1204 I2C Address Options
      3. 7.4.3 I2C Target Behavior
    5. 7.5 Register Maps
      1. 7.5.1 TMDS1204 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Source-Side Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Pre-Channel (LAB)
        2. 8.2.2.2 Post-Channel (LCD)
        3. 8.2.2.3 Common Mode Choke
        4. 8.2.2.4 ESD Protection
      3. 8.2.3 Application Curves
    3. 8.3 Typical Sink-Side Application
      1. 8.3.1 Design Requirements
      2. 8.3.2 Detailed Design Procedures
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 Supply Decoupling
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.2 ESD and Latch-Up Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V
Charged-device model (CDM), per JEDEC specification JS-002(2) ±1500
V(Supply) Supply Test Supply test, per JESD78F class II(3) 1.5 x VCC V
I(signal+) Positive signal pin latch-up Signal pin test, per JESD78F class II, immunity level A (all signal pins)(3) +100 mA
I(signal–) Negative signal pin latch-up Signal pin test, per JESD78F class II, immunity level A (all signal pins except pin 2 and pin 3)(3) –100 mA
Signal pin test, per JESD78F class II, immunity level B, annex A flow 1F (pin 2 and pin 3 are connected through 10 nF capacitors)(3)(4) –100 mA
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. .
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(3) JESD78F at maximum ambient temperature
(4) Per annex A flow 1F, negative pulse immunity on pin 2 and pin 3 is –15 mA without 10 nF series capacitors. Care should be given during ICT to limit test current to less than –15 mA.